Deep Dive Teardown of the Mercedes A Class Center Stack Display A247900710464 Automotive Infotainment

Availability

Published

Product Code

DDT-2007-808

Release Date

30/09/2020

Product Item Code

MER-A-247-900-71-04-64

Device Manufacturer

Mercedes-Benz

Device Type

Infotainment

Subscription

Automotive

Channel

Automotive - Infotainment Teardown

Deep Dive Teardown of the Mercedes A Class Center Stack Display A247900710464 Automotive Infotainment

The main ICs for the Mercedes A Class Center Stack Display were provided by NXP Semiconductors (SPC5605BVLQ4 as 32-bit automotive MCU) and Xilinx (XA6SLX25 as FPGA).

Related Analysis	Manufacturer	Analysis Type	Subscription Channel
Automotive LiDAR Market Update: Chinese Vendors Take Early Lead		Market	Powertrain, Body, Chassis & Safety
Deep Dive Teardown of the Mercedes A Class Center Stack Display A247900710464 Automotive Infotainment	Mercedes-Benz	Teardown	Automotive - Infotainment Teardown
Deep Dive Teardown of the Denso Suburu DNNS091 86271AN70A Automotive Cockpit Control Unit	DENSO Corp	Teardown	Automotive - Infotainment Teardown
Deep Dive Teardown of the Denso Suburu Legacy/Outback CID 86213AN65A Automotive Display	DENSO Corp	Teardown	Automotive - Infotainment Teardown
Deep Dive Teardown of the RoboSense RS-BPearl SE2004093370-4 LiDAR Sensor	RoboSense	Teardown	Automotive - LiDAR Teardown
Deep Dive Teardown of the Hitachi Subaru Eyesight 3rd Gen FU CAM202 240A Automotive Camera	Hitachi	Teardown	Automotive - Camera Teardown
Tesla FSD HW3.0	Tesla, Inc.	Teardown	Automotive - ADAS Controller Teardown
Deep Dive Teardown of the Delphi ESR 2.5 24 V Automotive Radar	Delphi	Teardown	Automotive - RADAR Teardown
Deep Dive Teardown of the BMW KaFAS Camera 66-51-5-A07-E30 Automotive Camera	BMW	Teardown	Automotive - Camera Teardown
Deep Dive Teardown of the Robosense RS-LiDAR-16 LiDAR Sensor	Suteng Innovation Technology Co., Ltd.	Teardown	Automotive - LiDAR Teardown

Make informed business decisions faster and with greater confidence

Start My Free Trial

Accessibility | Privacy Policy | Terms & Conditions | Conflict of Interest & Confidential Information | Ethics & Compliance

Upcoming Event Starts in

00 Days

00 Hrs

00 Min

CMC Seminar in Singapore October 27, 2026 • 8:45 a.m.

Save Your Spot

Join TechInsights What you’ll learn

✓ Networking Opportunities: High-impact knowledge sharing: Connect with leading semiconductor fabs and suppliers during exclusive networking opportunities, including a Welcome Reception on the evening of October 28.

✓ Designed for semiconductor device fabs, materials suppliers, equipment manufacturers, supply chain and process engineers, and financial and market analysts focused on semiconductor materials and manufacturing markets.

✓ 4 Industry-Focused Sessions: Market Outlook & Government Stimulus, Navigating the Intersections of Global Supply Chain Disruptions, Sustainability and Environmental Stewardship, and Quality-Driven Innovation for an Expanding Chip Industry

Strategic Technology Intelligence

Key Industry Topics

Empowering Semiconductor Innovation with Insight, Tools, and Industry Connections

TechInsights Capabilities

Our Experts

Capital Equipment Semiconductor Products

Fabless Semiconductor Products

Foundry Semiconductor Products

Integrated Device Manufacturer Products

Product Manufacturer Products

Government Products

Automotive Products

Mobile Carrier Products

Hyperscalers

Raw Materials

Latest Releases

2026 CMC Seminar in Singapore

Make informed business decisions faster and with greater confidence

The Authoritative Information Platform to the Semiconductor Industry.

About TechInsights

Get in Touch

Latest Insights