Automotive Teardown Subscriptions

Provide curated data with technical insight on ADAS to reveal design wins and provide valuable context how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for features description and dimensional data
• Costed bill of materials (BOM) spreadsheet
• RF block diagram
• System block diagram

Provide curated data with technical insight on cameras to reveal design wins and provide valuable context how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for features description and dimensional data
• Costed bill of materials (BOM) spreadsheet
• RF block diagram
• System block diagram

Provide curated data with technical insight on LiDAR to reveal design wins and provide valuable context how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for features description and dimensional data
• Costed bill of materials (BOM) spreadsheet
• RF block diagram
• System block diagram

Provide curated data with technical insight on radar to reveal design wins and provide valuable context how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for features description and dimensional data
• Costed bill of materials (BOM) spreadsheet
• RF block diagram
• System block diagram

Provide curated data with technical insight on audio amplifier to reveal design wins and provide valuable context how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for features description and dimensional data
• Costed bill of materials (BOM) spreadsheet
• RF block diagram
• System block diagram

Provide curated data with technical insight on infotainment to reveal design wins and provide valuable context how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for features description and dimensional data
• Costed bill of materials (BOM) spreadsheet
• RF block diagram
• System block diagram

Provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively.

• Isometric view of the product with dimensions and callouts of major mechanical or other visible features contributing to specific function
• Images of subassemblies and their major components
• Weights and dimensional attributes of key components
• Materials, fabrication process, assembly process and features, PCB dimensions and fabrication details*
• Surface treatments*
• Thermal solution
• Environmental/EMI (electromagnetic interference) and EMC (electromagnetic compatibility) seals
• IC selection

* = Where identifiable