Automotive Teardown Subscriptions
The latest competitive intelligence on cutting-edge LiDAR, ADAS, camera, infotainment, and audio amplifier modules.
Confidently design and build cost-effective automotive grade products faster and cheaper than any of your competitors.
Leading Automotive manufacturers, Tier 1 Automotive Suppliers, Robotics companies, LiDAR manufacturers and Semiconductor companies leverage TechInsights to inform their engineering efforts and technology strategy.
The Automotive Advantage
We offer our platform subscribers unmatched competitive technical intelligence across an expanding library of ADAS controllers, cameras, LiDAR, infotainment, and audio amplifier devices.
Automotive Reverse Engineering Channels
The following channels include system block diagrams, PCB board & component images, package images & x-rays, die images with markings, and a bill of materials:
Provide curated data with technical insight on ADAS to reveal design wins and provide valuable context how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for features description and dimensional data
- Costed bill of materials (BOM) spreadsheet
- RF block diagram
- System block diagram
Provide curated data with technical insight on cameras to reveal design wins and provide valuable context how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for features description and dimensional data
- Costed bill of materials (BOM) spreadsheet
- RF block diagram
- System block diagram
Provide curated data with technical insight on LiDAR to reveal design wins and provide valuable context how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for features description and dimensional data
- Costed bill of materials (BOM) spreadsheet
- RF block diagram
- System block diagram
Provide curated data with technical insight on radar to reveal design wins and provide valuable context how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for features description and dimensional data
- Costed bill of materials (BOM) spreadsheet
- RF block diagram
- System block diagram
Provide curated data with technical insight on audio amplifier to reveal design wins and provide valuable context how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for features description and dimensional data
- Costed bill of materials (BOM) spreadsheet
- RF block diagram
- System block diagram
Provide curated data with technical insight on infotainment to reveal design wins and provide valuable context how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for features description and dimensional data
- Costed bill of materials (BOM) spreadsheet
- RF block diagram
- System block diagram
Provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively.
- Isometric view of the product with dimensions and callouts of major mechanical or other visible features contributing to specific function
- Images of subassemblies and their major components
- Weights and dimensional attributes of key components
- Materials, fabrication process, assembly process and features, PCB dimensions and fabrication details*
- Surface treatments*
- Thermal solution
- Environmental/EMI (electromagnetic interference) and EMC (electromagnetic compatibility) seals
- IC selection
* = Where identifiable
Automotive IC Design Win Database
This subscription provides access to design wins from 500+ automotive products from 25+ tier 1 suppliers and 10 OEMs.
The Authoritative Information Platform to the Semiconductor Industry.
