The Advanced CMOS Essentials (ACE) deliverable for Advanced Packaging comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:

Downstream product teardown

Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features

Downstream product teardown Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features. Optical planar images Optical Cross Section Images SEM Cross-Section Images The ACE deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors