This report presents a Basic Functional Analysis of the FVU6 DLP controller die found inside the Texas Instruments DDP4421 DLP controller device. The DDP4421 device is a multichip package containing, not only the FVU6 die, but also a DRAM device (Toshiba LID03) that is not analyzed in detail within this report. The FVU6 die is flip-chip bonded to the LID03 within the package. This report covers the basic process used to manufacture the device, including process node and minimum transistor size. It will also examine the functional blocks found on the device and the percentage utilization for each of those blocks.