Product Item Code
Antenna Switch Module
Qualcomm QFE1035 Antenna Switch Process Node Assessment with TEM Option
This report presents a Process Node Assessment, with additional transmission electron microscopy (TEM) analysis of the Qualcomm HG11-NH137 die found inside the Qualcomm QFE1035 package. The QFE1035 antenna switch component is a wafer-level chip-scale package (WLCSP) measuring 2.5 mm x 1.8 mm x 0.5 mm thick.
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