This report presents a Device Overview analysis of the Nikon GUC die found inside the Nikon M3-1311 Expeed 5. The M3-1311 comes in a PBGA package, which is configured for a PoP application, with solder balls on both the top and bottom sides. This report contains the following detailed information:

Selected package photographs, package X-rays, die markings, and die photographs

Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors

Measurements of vertical and horizontal dimensions of major microstructural features

Plan-view optical micrograph of the die delayered to polysilicon

Identification of major functional blocks on a polysilicon die photograph

Table of functional block sizes and percentage of die utilization

High resolution top metal and polysilicon die photographs delivered in the ICWorks Browser