Latest Blogs and Commentary
Insight: How are Automakers Positioning to Compete in China's New Energy Vehicle Market?
Discover how 15 OEMs navigate China’s competitive auto market — explore diverse investment strategies shaped by overcapacity and rapid EV innovation in this Insight report.
Apple M4 Pro SoC HP NPU SOC Design Analysis
Unlock insights into Apple’s M4 Pro NPU design — examine standard cell schematics, routing efficiency, gate density, and DTCO strategies revealed through detailed GDSII analysis.
The Chip Insider®–US chip fab plans take off. NAND: This year’s sick man.
US chip fab plans take off: This year's pattern for chip makers to invest in the United States may seem to be new, but it was predicted earlier by TechInsights. Now it’s hard to keep up with.
DRAM's AI Boom and Sustainability: Navigating the Path to Sustainable Chip Manufacturing
The demand for DRAM is skyrocketing, fueled by AI's appetite for high-bandwidth memory (HBM). As the "big three" memory giants race to scale production over the next five years, the industry faces a critical juncture.
Narrative: Smartphone Memory Market Share Q1 2025
Explore Q1 2025 smartphone memory trends — analyze how delayed demand recovery, price declines, and inventory adjustments drove a 20% revenue drop, with Samsung maintaining market leadership.
Analysis: Transsion's Smartphone Shipments Continued to Decline in Q1 2025
Follow Transsion’s Q1 2025 performance — see how shipment declines, market challenges, rising costs, and intensified competition affected its global smartphone ranking.
Insight: Low-Light Pedestrian AEB, But Only One Night Vision A Possibility, TriEye SEDAR
Experience next-level night-time safety with TriEye SEDAR — combining SWIR imaging and lidar-like distance measurement to overcome AEB limitations in low-light driving.
The NEX Embedded Xeon Adopts Granite Rapids, New Brand
Discover how Intel’s Granite Rapids D CPUs are reshaping edge computing—delivering higher performance and core counts in the new Xeon 6 SoC series, revealed at ISSCC 2025.
Analysis: Lenovo-Motorola Smartphone Revenue Grew 27% YoY in Q1 2025
Track Lenovo-Motorola’s 7% YoY shipment growth and rising ASPs in Q1 2025—driven by strong Edge and Razr series sales and momentum in the Indian and Asia Pacific markets.
Analysis: Tech Giants in Automotive Infotainment – It’s an Android World
Explore how tech giants like Amazon, Apple, and NVIDIA are shaping automotive infotainment as vehicles shift toward software-defined platforms—highlighting Android’s growing role in this evolving ecosystem.
AMD Ryzen Series Strix Halo Advanced Packaging Quick Look Analysis
Uncover AMD’s latest APU innovation with our APQ summary of the AI Max+ 395 “Strix Halo” — explore its 16-core chiplet design, integrated GPU, NPU, and TSMC’s advanced InFO-oS packaging.
Huawei Matebook Fold Uses Kirin X90 Built on SMIC’s 7nm (N+2) Node
TechInsights confirms Huawei's Matebook Fold | Ultimate Design features the Kirin X90 SoC built on SMIC’s 7nm (N+2) process—debunking rumors of a breakthrough 5nm node.
Narrative: Smartphone Vendor Market Share in Smaller Markets, Q1 2025
Track global smartphone market trends from Q1 2025—297M units shipped amid geopolitical and tariff pressures. See top vendors, regional highlights, and market share insights.
Narrative: Notebook PC Market Share Q1 2025
Discover key insights from our Notebook PC Market Share Tracker—context on vendor, OS, and regional trends, with downloadable data via our Online Data Reports.
2025-06-20 - WFE by Application – June 20, 2025
Explore detailed forecasts for Wafer Fab Equipment by application, including Foundry, Logic, and Memory. Backed by financial data, supplier insights, and expert analysis to support CAPEX and market planning.
Winbond JAA123 Die (within W664GG6RB-06 Package) 20 nm 4 Gb DDR4
Detailed DPA of Winbond JAA123 die from W664GG6RB-06 package. Features 4 Gb DRAM built on 20 nm CMOS, 2nd-gen of Winbond’s stacked DRAM technology.
Narrative: Germany’s Handset Vendor Market Share by Operator: Q1 2025
Germany saw 5.1M handset shipments in Q1 2025, down 4% YoY. Apple leads carriers; Xiaomi holds steady. Tracks vendor share at T-Mobile, Vodafone, O2.
CPL Biweekly Update – Electromechanical and Integrated Circuits
Electromechanical component prices stayed flat in Q1 2025 and are expected to hold steady. IC price trends align with forecasts, with a Q4 2025 exception.
