First commercially available Wi-Fi 7 (802.11 be) wireless router: H3C Magic BE18000 Radu Trandafir Less than 2 months after the announcement of Qualcomm’s Wi-Fi 7 (IEEE 802.11 be) networking chipset, known since 2019 as Networking Pro Platform, we
TechInsights is first and foremost focused on supporting innovation and decision making. Because of the far-reaching interest in this latest technology, we thought we would share some of the discussions we’ve been having. Here are a few of the common questions we are seeing, and our corresponding answers.
Both leading foundries allowed customers to claim they were using a 4nm process when, in fact, they were using 5nm technology. This situation renders node names meaningless. Featured in our July 22 Microprocessor Report we are making this available, in full, for a limited time.
A collaboration between Dr. Stephen Russell (TechInsights) and Prof. Peter Gammon (PGC). ROHM released their 4th generation (Gen 4) MOSFET products this year. The new range includes MOSFETs rated to 750 V (increased from 650V) and 1200 V, with a number of the available TO247 packaged components automotive qualified up to 56A/24mΩ.
Teardown: ASUS ROG Rapture GT-AXE11000 router Routers are essential for any internet connections inside the home, whether it be for gaming, work or operating entertainment systems or smart home devices. ASUS has been in the business of creating
Teardown: Lenovo Mirage VR S3 headset Virtual reality (VR) headsets have taken off in recent years after remaining stagnant due to more content becoming available for users to enjoy both movies, games and other entertainment forms. With the inception
Teardown: Apple Macbook Pro 16 While Apple may be most famous for its handheld internet-enabled devices, its Macbook Pro line has been a steady supply of revenue for the company for many years. The Macbook Pro has been a staple for many corporate IT
Oppo Find X5 Pro improves Anti-Shake Technology with 5 axis image stabilization John Scott-Thomas The Oppo Find X5 Pro was released in March, 2022 and introduce 5 axis optical image stabilization. This allows a putative x3 improvement in anti-shake
Teardown: Samsung Galaxy Z Fold 5G Foldable phones, once thought to be a dream, have become a reality. While flip phones were introduced many years ago as one of the first iterations of expanding cell phone form factors, it wasn’t the screen that
Teardown: Lenovo ThinkPad X1 Fold laptop Foldable electronics are growing in number but remain a niche market overall. Consumers are interested in the technology but the practicality of using foldable electronics is something that just hasn’t caught
TechInsights has discovered what appears to be SMIC 7nm technology in the MinerVa Bitcoin Miner SoC. Learn why this matters and its market impact by downloading our Disruptive Technology Brief today.
In this webinar, Dr. Stephen Russell will delve into the innovations found within recently released GaN devices for both low-voltage ( 600 V) devices aimed at data centers and high voltage (>650 V) devices looking to enter the light industrial and even automotive markets.
Micron, and now other leading 3D NAND players such as Samsung, SK hynix, KIOIXA, and Western Digital (WD) have finished the risky product stage and just moved onto the high-volume product stage with a higher yield for SSD application. Dr. Jeongdong Choe compares each.
New ROHM 4th Generation SiC MOSFETs Featuring the Industry’s Lowest ON Resistance. Download the product brief for more details, and for a high-resolution image showing the trench structure with annotations.
In this Memory webinar, Dr. Jeongdong Choe gave an overview and discussed the latest memory technology trends and challenges, focusing on DRAM and NAND devices.
Having a true end-to-end, modem-to-antenna solution and capitalizing on the benefits of having developed class-leading mobile applications with integrated baseband (BB) processors/modems, there is nothing missing from Qualcomm’s portfolio.
