Micron Technology MT44K32M36RCT-125 3rd Generation RLDRAM Memory Floorplan Analysis

Product Code
MFR-1907-802
Release Date
25/09/2019
Availability
Published
Product Item Code
MIC-MT44K32M36RCT-125
Device Manufacturer
Micron Technology
Device Type
DRAM
Subscription
Memory - NAND & DRAM
Channel
Memory - DRAM Functional Analysis
Report Code
MFR-1907-802
This report presents a Memory Floorplan Analysis of the Micron F57R die found inside the Micron MT44K32M36RCT-125 package.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Plan-view SEM micrograph of the memory array delayered to active, WL, and BL layers
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in CircuitVision
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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