Product Code
MFR-1906-801
Release Date
Availability
Published
Product Item Code
SAN-FSK3_512G
Device Manufacturer
SanDisk
Device Type
NAND Flash
Subscription
Memory - NAND & DRAM
Channel
Memory - NAND Floorplan Analysis
Toshiba FSK3 512G 96-Layer 3D NAND Flash Memory Floorplan Analysis
This report presents a Memory Floorplan Analysis of the Toshiba FSK3_512G die found inside the SanDisk 9123DXDL9036 3D NAND Flash memory microSD card.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Plan-view SEM micrograph of the die delayered to the WL and BL layers
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in CircuitVision
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
 

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