
Product Code
MFR-1812-801
Availability
Published
Product Item Code
SAM-K9XVGY8J5M-CCK0
Device Manufacturer
Samsung
Device Type
NAND Flash
Subscription
Memory - NAND & DRAM
Channel
Memory - NAND Floorplan Analysis
Report Code
MFR-1812-801
Image

This report presents a Memory Floorplan Analysis of the Samsung K93KGD8U0M die found inside the Samsung K9XVGY8J5M-CCK0 package. The K9XVGY8J5M-CCK0 was extracted from a Samsung 1 TB SSD 860 QVO with the model number MZ-76Q1T0.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM bevel micrographs through the memory array at the mid-height to show the general layout and at the interconnect level routing the BL to measure the BL pitch
- SEM cross-sectional micrographs across the BL to show the die general view, including the full height of the memory array, as well as high-magnification SEM images at the top of the array to measure the BL pitch
- SEM cross-sectional micrographs across the WL to show the full height of the memory array
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on the polysilicon layer die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon level die photographs delivered in the CircuitVision software
A unique vault of trusted, accurate data at your fingertips
Our analysis goes as deep as required to reveal the inner workings and secrets behind a broad range of products.