This report presents a Memory Functional Analysis of the Toshiba FPV7 32G die found inside the Toshiba THGBMDG5D1LBAIL eMMC 5.0 NAND flash package.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) cross-sectional micrographs across the memory array showing the general structure of the flash cell array, die dielectric materials, metal interconnects, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to diffusion layer
• Identification of major functional blocks on a diffusion layer die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and diffusion level die photographs delivered in the CircuitVision software