What TechInsights expects for the semiconductor market in 2027.
We expect memory to make up 62% of semiconductor revenue next year, and the shortages behind that number to reach every part of the industry. Three expert-led webinars set out what that means for AI infrastructure, packaging, manufacturing, and sustainability. Register for any session to get the TechInsights Outlook: Five Trends Reshaping the Market report free, then every 2027 Outlook as it publishes.
One outlook series. Three webinars.
What AI will demand
Where capacity runs out
What growth costs in carbon
Grounded in TechInsights reverse engineering and market intelligence
Five Trends, Memory, AI, Compute, Advanced Packaging, Manufacturing, and Sustainability
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Reshaping the
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TechInsights Outlook 2027: Five Trends Reshaping the Market
Memory revenue will pass $1.6 trillion in 2027 and push the total semiconductor market above $2.6 trillion. Historically, memory has made up about a quarter of industry revenue. Next year it will make up 62%.
AI infrastructure is taking every HBM module suppliers can make, and 2027 output is already booked. The shortages that follow will reshape product design, chip architecture, manufacturing investment, and end-market growth. Companies that act now will protect their roadmaps. Those that treat this as another short memory cycle will enter 2027 exposed.
Featured report TechInsights Outlook 2027: Five Trends Reshaping the Market Included with your complimentary Platform account Read the reportMemory cycles to higher ground
HBM is sold out through 2027, and NAND is set to become the next bottleneck. Multi-year supply agreements are changing how memory is bought and taking the edge off future cycles.
Bottlenecks spread to packaging and mature nodes
TSMC's CoWoS and SoIC capacity is growing 20 to 25% a year, but logic and HBM demand will keep it the constraint. China will ease conventional DRAM and NAND supply. It won't ease HBM.
AI's impacts go beyond memory
Growth shifts from training to inference, where custom ASICs lead. Silicon photonics takes 42% of AI optical transceiver revenue, and datacenter power ICs pass $4.5 billion.
Carbon becomes a critical element for silicon
Semiconductor manufacturing emissions will hit a record 197 million MT CO₂e. Memory accounts for over a third, with 3D NAND above 300 layers a primary driver.
Cost-conscious consumers could constrain commerce
Higher memory prices are heading for the shelf. Expect a two-tier market, cut specifications at the low end, and some products that never launch.
Register for any webinar and we'll send your link to the full report in the TechInsights Platform.
The complete series
Seven reports. One view of 2027.
Five Trends is the first of seven 2027 Outlooks publishing in the TechInsights Platform. Each report goes deeper into one part of the market, and each is covered in one of the three webinars.
| 2027 Outlook report | Covered in webinar | Availability |
|---|---|---|
| Five Trends Reshaping the Market | All three webinars | Available now |
| Memory | 01 · AI Infrastructure | Coming soon |
| AI | 01 · AI Infrastructure | Coming soon |
| Compute | 01 · AI Infrastructure | Coming soon |
| Advanced Packaging | 02 · Packaging & Manufacturing | Coming soon |
| Manufacturing | 02 · Packaging & Manufacturing | Coming soon |
| Sustainability | 03 · Sustainability | Coming soon |
Choose your perspective
Three webinars. Pick your focus.
Join one webinar or follow the full series. Each one takes its Outlook reports further, with time for your questions in an audience Q&A.
AI Infrastructure: Outlook for 2027
Memory, Compute & AI
AI infrastructure will claim more semiconductor capacity in 2027 than any other market. This session looks at where the revenue and the shortages will land, from HBM and NAND supply to the custom silicon taking over inference.
What you'll learn
- The impact of memory scarcity on chip and system design
- The move from training to inference and the rise of custom ASICs
- Silicon photonics, 1.6T optical ports, and datacenter power ICs
Reports included
2027 Outlook for Semiconductor Advanced Packaging and Manufacturing
Packaging, Process & Capacity
Packaging and lithography will set the ceiling on 2027 output. See where capacity is tightening, which companies stand to gain, and why yield and qualification matter as much as new fab announcements.
What you'll learn
- CoWoS and SoIC capacity against logic and HBM demand
- HBM4, hybrid bonding, and chiplet architectures
- EUV tool supply and the widening gap in advanced logic
- China's growing role in DRAM and NAND supply
Reports included
Sustainability Outlook for 2027
Emissions, Nodes & Memory
As output grows, so does the industry's carbon footprint. This session breaks down where 2027 emissions will come from and what that means for manufacturing and supply chain decisions.
What you'll learn
- The 2027 forecast: a record 197 million MT CO₂e
- Why 3D NAND carries an outsized share of memory emissions
- Scope 2 electricity use at 2nm and 3nm
- Legacy nodes: lower intensity per unit, over 40% of total emissions
Reports included
Free Platform access
Three webinars. Seven reports. One free account.
Choose a webinar and register with your corporate email. We'll send your link to TechInsights Outlook 2027: Five Trends Reshaping the Market right away, and we'll send you each of the six 2027 Outlook reports as it publishes in the TechInsights Platform. New to TechInsights? Your complimentary Platform account also gives you access to more free semiconductor intelligence.
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