AI at TechInsights
Your Monthly Roundup of What We're Publishing on AI Chips, Packaging, and HPC
Register free for the TechInsights Platform and get AI at TechInsights, a monthly digest summarizing our latest analysis across AI accelerators, advanced packaging, and high performance compute – plus a look at how TechInsights is extending its coverage of HPC systems from silicon to system.
featured proprietary insights
Inside this month's AI at TechInsights:
AI's cost curve bends downward on two fronts: models and silicon
"We forecast datacenter capex to continue growing at a CAGR of approximately 22.9% through 2030, reaching $1.54 trillion. The Big 4 hyperscalers continue to expand cloud operations and embed AI features across their product lines, while Chinese hyperscalers keep scaling in parallel: Bytedance's datacenter capex is forecast to grow from $16.7 billion in 2025 to $18.4 billion in 2026 and $27.7 billion by 2030, while Huawei continues developing its own cluster-level AI systems, supported by the Chinese government as an alternative to NVIDIA amid ongoing export restrictions."

Explore the full edition:
- The Token Economy Runs on Servers, Storage, and Shortage
- Inside Apple/TSMC's 2nm Processor
- Inside Amazon’s AWS Trainium2
- ASICs Accelerate, CPUs Return, DRAM always Win
- OpenAI’s Jalapeño and Vertically Integrated AI Compute
- Software Efficiency Hedges Against Memory Costs Rise
Each entry links to the full report, so you always know what's available if you want the complete analysis behind the summary.
HPC Coverage at TechInsights
The depth behind this month's digest
AI at TechInsights draws on our full body of AI and HPC research, including our expanding coverage connecting structural analysis, independent benchmarking, and power delivery insight across the AI accelerator ecosystem.
Silicon-to-system view
Summaries connect design decisions to platform-level outcomes, not just chip specs.
Real workload data
Coverage of independent benchmarking, beyond vendor-published peak numbers.
Physical implementation insight
Power delivery and signal integrity findings, distilled from 3D X-ray analysis.





