Teardown Subscriptions

Automotive

TechInsights equips you with the insights you need to successfully navigate the automotive semiconductor market.

Light vehicle production and semiconductor demand have historically grown at a similar rate – until recently. TechInsights is currently forecasting a steep upswing in semiconductor demand, surpassing the growth trajectory of vehicle production as we look ahead to the future.

TechInsights content is available to all Amazon employees

Your Automotive Solutions

Through TechInsights, Platform members have the opportunity to subscribe to automotive solutions and multiple add-ons all in one place.

Executive Insights

Executive Insights

Timely, rapid insights on the megatrends shaping the semiconductor value chain.

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Market Opportunity

Market Opportunity

Rich granular market data and insights ensuring you can compete to win.

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Connectivity

Module Innovation

Unmatched coverage of product architecture.

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EV

Procurement

Insight into when and at what price to procure electronics components with insight into lead-times.

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Image Sensor

Semiconductor Innovation

Dive deep into innovations across the automotive semiconductor value chain to optimize your systems' strategy, design, and production.

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Image Sensor

Supply Chain

Get a full view of the supply chain and evaluate supplier capacity.

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Add-on Solutions

Add-on solutions provide supplementary features and functionalities, enhancing the capabilities of the core TechInsights product or service.

Semiconductor Manufacturing Economics

Semiconductor Manufacturing Economics

Supply relationship and activity databases for semiconductor growth areas and detailed volume forecasts for chips in automotive and consumer electronics markets.

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Semiconductor Manufacturing Economics

BOM Database and BOM Database with Subsystems

TechInsights' BOM costing and design wins database contains three decades of accumulated semiconductor data from our Teardown analysis of consumer electronics products.

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Semiconductor Manufacturing Economics

Component Price Landscape
(CPL)

Leading index for tracking 140+ commodity EE component categories and 50,000+ MPNs, aiding purchasing decisions.

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Semiconductor Manufacturing Economics

Semiconductor Market Analysis by Technology

Market forecasts, market share, technology roadmaps, and supply chain signaling for all major technologies including compute, sensors/image, analog/RF, power, memory and SoC.

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Semiconductor Manufacturing Economics

Semiconductor Manufacturing Carbon Model

Detailed bottom-up analytics around carbon emissions including company and fabrication specific process and facility calculations that the Fabless industry needs to support key decisions—from site selection to carbon emission mitigation strategies—and that foundry customers need to evaluate the impact of their chosen foundry partner.

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Semiconductor Manufacturing Economics

Component Price Analyzer (CPA)

The CPA tool examines the Bill of Materials (BOMs) for individual customers in the field of electrical engineering. CPA compares the prices of components provided by the customers with the average market prices based on their purchase volume.

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Semiconductor Manufacturing Economics

Semiconductor Market Analysis by End Market

Market forecasts, market share, technology roadmaps, and supply chain signaling for all major companies and end markets across mobile, cloud/datacenter, AI, automotive, and more.

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Semiconductor Manufacturing Economics

Manufacturing Insights

Get visibility into the semiconductor supply chain so you can optimize production planning and increase quality assurance. Gain a competitive advantage by making data-driven decisions, accelerating time to market, and fostering innovation when it comes to product development.

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Expand Your Automotive Solutions

Executive Insights provides a high-level view to contextualize our deep, comprehensive data. Understand how megatrends like AI, geopolitics, and macroeconomic factors affect the automotive sector. Appraise product launches and corporate strategic shifts from a wide perspective. Executive Insights comprises a range of weekly and monthly data sets and insights to provide timely information.
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What's included

Chip Insider

The Chip Insider is a go-to resource for senior semiconductor executives. It provides straightforward reports on current industry issues, trends, strategies, and tactics. Get insider insights on supplier-customer dynamics, corporate strategies, industry trends, challenges, projections, and historical facts, presented in a clear and informative manner.

 
  • Inquiry Privileges
  • Insight Reports

McClean Report

The McClean Report helps you identify how to better position your business to be competitive. You don’t have to be an expert in semiconductors to understand the broad variety of analyses and perspectives, and how The McClean Report can complement your business, and your business decision-making – not only from the technical or legal point of view but also from the geopolitical, and regional market(s) angle.

 
  • Inquiry Privileges
  • Insight Reports

Microprocessor Report Enterprise License

Microprocessor Report Enterprise License is an industry-leading weekly journal covering new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.

 
  • Block Diagram
  • Component Price and Lead-time Trends
  • Competitor Analysis
  • EE Component Usage Across Products
  • High Resolution Images
  • IC Floorplan
  • Inquiry Privileges
  • Insight Reports
  • Packaging
  • Performance Analysis
  • Process
  • Product Features

Semiconductor Analytics

Semiconductor Analytics provides weekly data visualization on semiconductor supply and demand analysis, and provides granular level sales per week and allows for quarterly and yearly comparisons.

 
  • Competitor Analysis
  • Data Visualisation
  • Demand Forecasts
  • Inquiry Privileges
  • Insight Reports
  • Market Data
  • Supply Analysis

TCI Graphics

TechInsights' TCI Graphics content provides a unique view into the health of the semiconductor manufacturing ecosystem, including key performance indicators across electronics, semiconductor, and equipment supply chains with simple charts to communicate changes in the market with weekly and monthly views.

 
    Understand the evolving automotive landscape to meet demand and outpace competitors during a time of explosive growth. With forward-looking forecasts, research, and insight, you can map out component demand across automotive electronics while understanding what is driving it all today. That insight lets you optimize production to lower costs, tailor messaging to outperform competitors, and craft strategies for long term success.
    Offering
    What's included

    Autonomous Vehicles

    TechInsights’ Autonomous Vehicles coverage offers forecasts and analysis both of today’s ADAS technologies as well as an expert, independent view on what the future of automated driving will bring, and where the resulting opportunities will lie. It includes deep coverage at the system, semiconductor and sensor levels, as well as a broad view of whole value chain.

     
    • Competitor Analysis
    • Data Visualisation
    • Demand Forecasts
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Supply Analysis

    Electric Vehicles

    TechInsights’ Electric Vehicles coverage offers forecasts and analysis of the rapidly-growing and strategically vital electric vehicle market. It offers deep analyses at the system, semiconductor, and sensor levels, as well as a broad view of the whole value chain, along with valuable insights covering global and regional regulatory and policy dynamics, OEM strategies, emerging technologies, and economies.

     
    • Competitor Analysis
    • Data Visualisation
    • Demand Forecasts
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Supply Analysis

    Infotainment and Telematics

    TechInsights’ Automotive Infotainment and Telematics covers all key aspects of in-vehicle infotainment, wireless communication, and connectivity adoption in the connected car. It includes detailed semiconductor and system market sizing, including unit, revenues and ASPs, along with granular Tier 1 and semiconductor supplier market shares. It also looks at software trends, including OS usage, and OTA implementations.

     
    • Competitor Analysis
    • Data Visualisation
    • Demand Forecasts
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Supply Analysis

    Powertrain Body Chassis Safety

    TechInsights’ Powertrain, Body, Chassis and Safety is the industry’s premier source of market information on the complex global automotive electronics market. It covers over 100 different automotive electronics systems, including the resulting semiconductor and sensor demand. It also assesses the impact of vehicle architecture change on the automotive ecosystem.

     
    • Competitor Analysis
    • Data Visualisation
    • Demand Forecasts
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Supply Analysis

    Automotive Semiconductors

    Semiconductor Market Analysis provides a holistic perspective of the semiconductor value chain, including examination of end markets, a robust roadmap analysis, detailed semiconductor supplier profiling, and a comprehensive evaluation of semiconductor supply networks. It empowers customers to increase forecast accuracy, negotiate pricing more effectively, mitigate supply risks, and explore alternative suppliers.

     
    • Competitor Analysis
    • Data Visualisation
    • Demand Forecasts
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Supply Analysis
    Design to win by monitoring and tracking your competitors’ developments in product architecture and design; exploring advances in mechanical packaging and construction, including design features to withstand environmental pollutants and operational conditions, and understanding the cost breakdown by functional blocks, subassemblies, and product level to ensure your pricing is competitive.
    Offering
    What's included

    ADAS Controller Teardown

    ADAS Controller Teardown provides curated data with technical insight on ADAS to reveal design wins and provide valuable context on how individual components contribute to the larger picture. They include:

    • ICs identification and costing
    • Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
    • Die photos for major ICs and tables for features descriptions and dimensional data
    • Costed bill of materials (BOM) spreadsheets
    • RF block diagrams
    • System block diagrams

     

     
    • Block Diagram
    • Competitor Analysis
    • Cost Analysis
    • High Resolution Images
    • Inquiry Privileges
    • Product Features

    ADAS Design Material and Assembly Teardown

    ADAS Design Material and Assembly provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively. It also includes:

    • Isometric views of the products with dimensions and callouts of major mechanical or other visible features contributing to specific functions
    • Images of subassemblies and their major components
    • Weights and dimensional attributes of key components
    • Materials, fabrication processes, assembly processes and features, PCB dimensions and fabrication details*
    • Surface treatments*
    • Thermal solutions
    • Environmental/EMI (electromagnetic interference) and EMC (electromagnetic compatibility) seals
    • IC selection

     

    * = Where identifiable

     
    • Block Diagram
    • Competitor Analysis
    • Cost Analysis
    • High Resolution Images
    • Inquiry Privileges
    • Product Features

    Audio Amplifier Teardown

    Audio Amplifier Teardown provides curated data with technical insight on audio amplifiers to reveal design wins and provides valuable context on how individual components contribute to the larger picture. They include:

    • ICs identification and costing
    • Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
    • Die photos for major ICs and tables for feature descriptions and dimensional data
    • Costed bill of materials (BOM) spreadsheets
    • RF block diagrams
    • System block diagrams

     

     
    • Block Diagram
    • Competitor Analysis
    • Cost Analysis
    • High Resolution Images
    • Inquiry Privileges
    • Product Features

    Camera Teardown

    Camera Teardown provides curated data with technical insight on cameras to reveal design wins and provide valuable context on how individual components contribute to the larger picture. They include:

    • ICs identification and costing
    • Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
    • Die photos for major ICs and tables for feature descriptions and dimensional data
    • Costed bill of materials (BOM) spreadsheets
    • RF block diagrams
    • System block diagrams

     

     
    • Block Diagram
    • Competitor Analysis
    • Cost Analysis
    • High Resolution Images
    • Inquiry Privileges
    • Product Features

    Infotainment Teardown

    Infotainment Teardown provides curated data with technical insight on infotainment to reveal design wins and provides valuable context how individual components contribute to the larger picture. They include:

    • ICs identification and costing
    • Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
    • Die photos for major ICs and tables for feature descriptions and dimensional data
    • Costed bill of materials (BOM) spreadsheets
    • RF block diagrams
    • System block diagrams

     

     
    • Block Diagram
    • Competitor Analysis
    • Cost Analysis
    • High Resolution Images
    • Inquiry Privileges
    • Product Features

    LiDAR Design Material and Assembly Teardown

    LiDAR Design Material and Assembly provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively.

     
    • Block Diagram
    • Competitor Analysis
    • Cost Analysis
    • High Resolution Images
    • Inquiry Privileges
    • Product Features

    LiDAR Teardown

    LiDAR Teardown provides curated data with technical insight on LiDAR to reveal design wins and provides valuable context how individual components contribute to the larger picture. They include:

    • ICs identification and costing
    • Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
    • Die photos for major ICs and tables for feature descriptions and dimensional data
    • Costed bill of materials (BOM) spreadsheets
    • RF block diagrams
    • System block diagrams

     

     
    • Block Diagram
    • Competitor Analysis
    • Cost Analysis
    • High Resolution Images
    • Inquiry Privileges
    • Product Features

    Automotive IC Win Database

    The Automotive IC Design Win Database provides access to design wins from 500+ automotive products from 25+ tier 1 suppliers and 10 OEMs.

     
    • Block Diagram
    • Cost Analysis
    • Demand Forecasts
    • High Resolution Images
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Product Features
    In the current competitive market conditions in the electronic components industry, sourcing, procurement, supply chain, and commodity managers need a simple reliable set of tools to identify the most competitive pricing with acceptable lead-times for the components they procure. TechInsights’ Semiconductor procurement portfolio of products delivers just that. Our solution provides trends and forecasting about prices and lead-times, which answers to when to buy; reference prices for contract price negotiations; and provides should costs and price of semiconductor components.
    Offering
    What's included

    Component Price Analyzer

    Component Price Analyzer (CPA) is an interactive pricing tool that analyzes customers' electronic component BOMs by comparing customer-entered component prices with market prices for their specific product volume, allowing customers to receive pricing analysis, lead-time analysis, and access to a CSV spreadsheet with the market pricing and lead-time details of their Manufacturer Part Numbers (MPNs).

     
    • Component Price and Lead-time Trends
    • Competitor Analysis
    • Cost Analysis
    • Data Visualisation
    • Demand Forecasts
    • EE Component Usage Across Products
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Product Features

    Component Price Landscape

    Component Price Landscape (CPL) tracks pricing and lead-time trends for commodity electronic components that are used in many electronic designs. CPL is the industry’s premier tool for tracking pricing and lead-time trends for commodity electronic components.

     
    • Component Price and Lead-time Trends
    • Competitor Analysis
    • Cost Analysis
    • Data Visualisation
    • Demand Forecasts
    • EE Component Usage Across Products
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Product Features

    IC Cost and Price Model

    The IC Cost and Price Model includes wafer fabrication, test and packaging costs, coverage of technologies from 100mm to 300mm wafers, semiconductor manufacturing cost and selling price estimates, and cost and price by volume from 2015 to 2030. It enables users to easily estimate the cost and selling price of low-power silicon ICs.

     
    • Data Visualisation
    • Inquiry Privileges

    Strategic Cost and Price Model

    The Strategic Cost and Price Model includes cost and price for leading-edge 300mm wafer processes, technology roadmaps for 3D NAND, DRAM, and Logic, equipment and materials requirements, and cost and price by process, volume, and date from 2000 to 2035. It enables users to explore past, current, and future technologies from three leading producers in four segments.

     
    • Data Visualisation
    • Inquiry Privileges

    Discrete and Power Cost and Price Model

    The Discrete and Power Products Cost and Price Model includes wafer fabrication, test, and packaging costs, coverage of 100mm to 300mm wafer sizes, semiconductor manufacturing cost and selling price estimates, and cost and price by volume from 2015 to 2030. It enables users to easily estimate cost and selling price of high-power silicon and compound semiconductor ICs and discrete devices.

     
    • Data Visualisation
    • Inquiry Privileges

    Assembly and Test Cost and Price Model

    The Assembly and Test Cost and Price Model includes cost and price for assembly and test of semiconductors, unit cost and price, materials and equipment requirements, and cost and price by process, volume, and date from 2010 to 2035. It enables users to easily estimate the manufacturing cost and selling price of most IC testing and assembly operations.

     
    • Data Visualisation
    • Inquiry Privileges

    Fab Database

    The Fab Database includes details of location, key dates, partners, capital investment, incentives, nodes, products, capacity, and several analysis graphs of capacity by product, company, country and more.

     
    • Competitor Analysis
    • Data Visualisation
    • Inquiry Privileges
    • Market Data
    • Product Features
    Examine IC and packaging structure, and materials, as inputs to reliability and costing studies, compare and evaluate integrated circuit die technologies to aid in vendor selection, track enabling technologies supporting emerging opportunities like vehicle electrification, and monitor the demand forecast for foundries holistically or by technology vertical.
    Offering
    What's included

    AI Processor Service

    AI Processor content covers hardware technologies and products from leading AI companies. It provides deep technology analysis and head-to-head product comparisons, as well as analysis of company prospects in this rapidly developing market segment. We explain which products will win designs and why. TechInsights’ AI Processor content provides a forward-looking view, helping sort through competing claims and products.

     
    • Block Diagram
    • Component Price and Lead-time Trends
    • Competitor Analysis
    • Cost Analysis
    • High Resolution Images
    • Inquiry Privileges
    • Insight Reports
    • Performance Analysis
    • Product Features

    Advanced Packaging

    TechInsights' Advanced packaging coverage helps you understand all aspects of advanced logic technologies, gain visibility into the competition’s historical – and anticipated – approach, and make better next-node technology choices.

     
    • Competitor Analysis
    • Data Visualisation
    • Inquiry Privileges
    • Insight Reports
    • Packaging

    Battery Cell Essentials

    TechInsights' Battery Cell Essentials profiles the innovations impacting battery life extension, energy density, safety, cost reduction, charging speed, etc. The analysis includes materials and structural analysis (anode, cathode, electrolyte, and separator) of innovative lithium-ion battery cells found in phones, wearables, laptops, tablets, pens, and more. The analysis will also show details of the battery pack, its fit in the source device, and the components found on the battery protection control module.

     
    • Competitor Analysis
    • Inquiry Privileges
    • Insight Reports
    • Process

    Battery Characterization

    TechInsights' Battery Characterization covers cells from a range of market applications, with a focus on mobile and smaller (wearables, pens, etc.) form-factors from leading OEMs. The analysis provides insight into the thermal characteristics of devices during wireless and wired charging as well as lithium-ion battery performance during operation over a range of different conditions.

     
    • Competitor Analysis
    • Inquiry Privileges
    • Insight Reports
    • Systems

    CMRS Forecast Pro

    TechInsights' CMRS Forecast Pro provides critical datasets for semiconductors, silicon, packaging, designs and reticles along with semiconductor inventories, capacity and supply-demand analysis.

     
    • Data Visualisation
    • Demand Forecasts
    • Inquiry Privileges
    • Market Data

    Chiplet

    Our Chiplets coverage tracks usage across 33 end markets and provides a breakdown of chip market research total addressable market (TAM) split between monolithic and chiplet, enabling customers to better understand the market opportunity for advanced packaging alternatives such as chiplets and to better target the highest potential TAM opportunities.

     
    • Block Diagram
    • Competitor Analysis
    • Cost Analysis
    • Demand Forecasts
    • EE Component Usage Across Products
    • Inquiry Privileges
    • Market Data
    • Supply Analysis
    • Product Features

    Circuit Analysis

    TechInsights' Circuit Analysis includes hierarchical schematics, delivered in a highly interactive, easy-to-navigate environment including cross-probing to layout capability, of the active pixels, column readout, ADC, row control, ramp generator, and bandgap.

     
    • Circuit
    • Competitor Analysis
    • Inquiry Privileges
    • Insight Reports

    Device Essentials

    TechInsights' Device Essentials provides broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.

     
    • Competitor Analysis
    • Inquiry Privileges
    • Insight Reports
    • Packaging
    • Process

    Digital Floorplan

    TechInsights' Digital Floorplan is a high-level view of SoC design quality, focusing on leading-edge APU, CPU, GPU, AI accelerator, FPGA, baseband / connectivity, VPU, advanced MCU components, plus emerging applications such as AR and vision processing SoCs.

     
    • Competitor Analysis
    • Data Visualisation
    • IC Floorplan
    • Inquiry Privileges
    • Insight Reports

    Image Signal Processor

    TechInsights' Image Signal Processor content provides insights into the functional blocks and die utilization of stacked and standalone image signal processors. This content provides floorplan (functional) analysis of image signal processors (ISP) in applications such as smartphone, automotive imaging and optical sensing, computer/machine vision, edge AI, IoT, LiDAR, security/ surveillance, and more.

     
    • Competitor Analysis
    • IC Floorplan
    • Inquiry Privileges
    • Insight Reports

    Power Essentials (GaN, SiC, Si)

    TechInsights' Power Essentials provides in-depth process analysis for GaN, SiC, and Si power devices, and comprehensive coverage of device metrics and salient features. Analysis includes detailed structural and material analysis using techniques such as SEM, TEM, and SCM/sMIM, covering package and die images/X-rays, SEM planview and cross-sectional images with annotated SEM-EDS material analysis conclusions, and cross-sectional TEM images with annotated TEM-EDS/EELS analysis conclusions for GaN devices, cross-sectional and planar SCM (sMIM) analysis for Si and SiC.

     
    • Competitor Analysis
    • Inquiry Privileges
    • Insight Reports
    • Process

    Power Semiconductor - Silicon Carbide (SiC) Process Flow - 01

    TechInsights' Silicon Carbide Process Flow provides in-depth process flow analysis detailing the manufacturing steps to fabricate innovative SiC power devices from wafer-in to wafer-out. Analysis includes process architecture, mask list, and integration-level process steps, layout (.GDS) decomposed into process layers, and emulated device structure, tool type as well as design rules, layer dimensions, and process assumptions.

     
    • Competitor Analysis
    • Inquiry Privileges
    • Insight Reports
    • Process Flow

    RFIC Packaging

    Enables the comparison of various RFIC advanced packaging implementations to gain a better understanding of how they impact RF system design. This includes aspects such as DC and RF performance pertaining to module packaging, size and thermals, and heterogeneous integration. Analysis includes SEM cross-sectional and EDS materials analyses.

     
    • Block Diagram
    • High Resolution Images
    • Packaging

    SoC Markets

    For Fabless, IDM Semiconductor, IP vendors, and Foundries, SoC Markets explains how to optimize design costs for intricate SoCs. Understanding which chip designs and applications are driving market growth allow these companies to validate licensing and royalty revenues. With Reverse Engineering, market presence and technical performance are verified with continuous finetuning of existing models.

     
    • Block Diagram
    • Competitor Analysis
    • Cost Analysis
    • Data Visualisation
    • Demand Forecasts
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Supply Analysis
    • Product Features

    Transceiver Architecture - Mobile RF

    TechInsights' Transceiver Architecture enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge 5G and FR2 transceivers. It includes and builds on the Transceiver Floorplan content to identify key functional blocks and the connections between them.

     
    • Circuit
    • Competitor Analysis
    • Inquiry Privileges
    • Insight Reports

    Transceiver Floorplan

    TechInsights' IoT Connectivity SoC Transceiver Floorplan provides insight into competitive designs including high-level block identification, high-level process data, and manufacturing costs for leading-edge transceivers in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more.

     
    • Competitor Analysis
    • IC Floorplan
    • Inquiry Privileges
    • Insight Reports

    Transceiver Architecture - IoT Connectivity SoC

    TechInsights' IoT Connectivity SoC Transceiver Architecture coverage enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge IoT transceiver chipsets in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more. It includes and extends Transceiver Floorplan analyses to identify key functional blocks and the connections between them.

     
    • Circuit
    • Competitor Analysis
    • Inquiry Privileges
    • Insight Reports

    Transceiver Basic Floorplan

    TechInsights' Transceiver Basic Floorplan targets the most innovative IoT SoC devices to provide key information on die utilization, block sizes and functionality, die cost and more, to better understand the core functions of the SoC chip.

     
    • Competitor Analysis
    • IC Floorplan
    • Inquiry Privileges
    • Insight Reports
    De-risk your planning with access to comprehensive supply relationship and activity databases for key automotive semiconductors. Providing market shares for automotive semiconductor device types, along with average lead times, tracking of OEM semiconductor strategies including supplier capacity and capital expenditures, coupled with analysis of market dynamics that impact the supply chain allows you to plan with confidence.
    Offering
    What's included

    IC Cost and Price Model

    The IC Cost and Price Model includes wafer fabrication, test and packaging costs, coverage of technologies from 100mm to 300mm wafers, semiconductor manufacturing cost and selling price estimates, and cost and price by volume from 2015 to 2030. It enables users to easily estimate the cost and selling price of low-power silicon ICs.

     
    • Data Visualisation
    • Inquiry Privileges

    Component Price Analyzer

    Component Price Analyzer (CPA) is an interactive pricing tool that analyzes customers' electronic component BOMs by comparing customer-entered component prices with market prices for their specific product volume, allowing customers to receive pricing analysis, lead-time analysis, and access to a CSV spreadsheet with the market pricing and lead-time details of their Manufacturer Part Numbers (MPNs).

     
    • Component Price and Lead-time Trends
    • Competitor Analysis
    • Cost Analysis
    • Data Visualisation
    • Demand Forecasts
    • EE Component Usage Across Products
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Product Features

    Component Price Landscape

    Component Price Landscape (CPL) tracks pricing and lead-time trends for commodity electronic components that are used in many electronic designs. CPL is the industry’s premier tool for tracking pricing and lead-time trends for commodity electronic components.

     
    • Component Price and Lead-time Trends
    • Competitor Analysis
    • Cost Analysis
    • Data Visualisation
    • Demand Forecasts
    • EE Component Usage Across Products
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Product Features

    Autonomous Vehicles

    TechInsights’ Autonomous Vehicles coverage offers forecasts and analysis both of today’s ADAS technologies as well as an expert, independent view on what the future of automated driving will bring, and where the resulting opportunities will lie. It includes deep coverage at the system, semiconductor and sensor levels, as well as a broad view of whole value chain.

     
    • Competitor Analysis
    • Data Visualisation
    • Demand Forecasts
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Supply Analysis

    Electric Vehicles

    TechInsights’ Electric Vehicles coverage offers forecasts and analysis of the rapidly-growing and strategically vital electric vehicle market. It offers deep analyses at the system, semiconductor, and sensor levels, as well as a broad view of the whole value chain, along with valuable insights covering global and regional regulatory and policy dynamics, OEM strategies, emerging technologies, and economies.

     
    • Competitor Analysis
    • Data Visualisation
    • Demand Forecasts
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Supply Analysis

    Infotainment and Telematics

    TechInsights’ Automotive Infotainment and Telematics covers all key aspects of in-vehicle infotainment, wireless communication, and connectivity adoption in the connected car. It includes detailed semiconductor and system market sizing, including unit, revenues and ASPs, along with granular Tier 1 and semiconductor supplier market shares. It also looks at software trends, including OS usage, and OTA implementations.

     
    • Competitor Analysis
    • Data Visualisation
    • Demand Forecasts
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Supply Analysis

    Powertrain Body Chassis Safety

    TechInsights’ Powertrain, Body, Chassis and Safety is the industry’s premier source of market information on the complex global automotive electronics market. It covers over 100 different automotive electronics systems, including the resulting semiconductor and sensor demand. It also assesses the impact of vehicle architecture change on the automotive ecosystem.

     
    • Competitor Analysis
    • Data Visualisation
    • Demand Forecasts
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Supply Analysis

    Automotive Vendor Landscape

    TechInsights' automotive vendor landscape provides a comprehensive view into the semiconductor suppliers serving the automotive electronics industry. Insight includes supplier profiles and the evaluation of semiconductor supply networks including production capacity and lead times. This data empowers customers to negotiate pricing more effectively, mitigate supply risks, and explore alternative suppliers.

     
     

    Automotive IC Win Database

    The Automotive IC Design Win Database provides access to design wins from 500+ automotive products from 25+ tier 1 suppliers and 10 OEMs.

     
    • Block Diagram
    • Competitor Analysis
    • Cost Analysis
    • Demand Forecasts
    • High Resolution Images
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Product Features

    Automotive Semiconductors

    Semiconductor Market Analysis provides a holistic perspective of the semiconductor value chain, including examination of end markets, a robust roadmap analysis, detailed semiconductor supplier profiling, and a comprehensive evaluation of semiconductor supply networks. It empowers customers to increase forecast accuracy, negotiate pricing more effectively, mitigate supply risks, and explore alternative suppliers.

     
    • Competitor Analysis
    • Data Visualisation
    • Demand Forecasts
    • Inquiry Privileges
    • Insight Reports
    • Market Data
    • Supply Analysis

    Strategic Cost and Price Model

    The Strategic Cost and Price Model includes cost and price for leading-edge 300mm wafer processes, technology roadmaps for 3D NAND, DRAM, and Logic, equipment and materials requirements, and cost and price by process, volume, and date from 2000 to 2035. It enables users to explore past, current, and future technologies from three leading producers in four segments.

     
    • Data Visualisation
    • Inquiry Privileges

    Discrete and Power Cost and Price Model

    The Discrete and Power Products Cost and Price Model includes wafer fabrication, test, and packaging costs, coverage of 100mm to 300mm wafer sizes, semiconductor manufacturing cost and selling price estimates, and cost and price by volume from 2015 to 2030. It enables users to easily estimate cost and selling price of high-power silicon and compound semiconductor ICs and discrete devices.

     
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    Assembly and Test Cost and Proce Model

    The Assembly and Test Cost and Price Model includes cost and price for assembly and test of semiconductors, unit cost and price, materials and equipment requirements, and cost and price by process, volume, and date from 2010 to 2035. It enables users to easily estimate the manufacturing cost and selling price of most IC testing and assembly operations.

     
    • Data Visualisation
    • Inquiry Privileges

    Fab Database

    The Fab Database includes details of location, key dates, partners, capital investment, incentives, nodes, products, capacity, and several analysis graphs of capacity by product, company, country and more.

     
    • Competitor Analysis
    • Data Visualisation
    • Inquiry Privileges
    • Market Data
    • Product Features
     

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