This report presents a Package analysis (PKG) of the Infineon FS03MR12A6MA1LB automotive 1200 V 400 A HybridPACK module. The Infineon FS03MR12A6MA1LB contains a direct cooled 'PinFin' base plate and a high performance Si3N4 ceramic for superior insulation for extending EV range.
The PKG includes observed device metrics and salient features supported by the following unannotated image folders:

• Package photographs
• Die photographs
• Optical and SEM package cross-section photographs
• SEM-EDS spectra of selected package materials

The image set for a PKG project is derived from a package cross sectional analysis, supplemented by jet etch decapsulation, when applicable. Value added information, such as additional planes of cross-sectioning, may be included on a case-by-case basis. The PKG deliverable provides competitive benchmarking information and enables cost-effective tracking of multiple competitors' technology.