This report presents a Package analysis (PKG) of the STMMicroelectronics ambient light sensor from the Apple iPhone 13 Pro. The PKG includes observed critical dimensions and salient features supported by the following image folders:

• Downstream product teardown overview
• Package photographs
• Package cross section
• SEM-EDS spectra of select features
• Die photograph and non-invasive optical photographs of die features

The image set for a PKG project is derived from a single cross-sectioned module sample and a single die sample. Value added information, such as additional planes of cross-sectioning, may be included on a case-by-case basis. The PKG deliverable provides competitive benchmarking information and enables cost-effective tracking of multiple competitors' technology.