This report presents a Basic Floorplan Analysis of the MediaTek AM10729CW die found inside the MT2811SP component, which was extracted from the Sony WF-1000XM3 wireless stereo headset. This features its own branded Bluetooth Audio SoC TechInsights has observed. It is good to see the competition in the fast-growing TWS wireless headphone market.
This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to the polysilicon layer
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process