This report presents a Basic Floorplan Analysis of the Maxim ME14A die found inside the Maxim MAX32666 component, which is a low-power microcontroller with Bluetooth 5 for wearables. This is TechInsights’ first time observing the Maxim Integrated Bluetooth MCU. It features an ARM Cortex-M4 MCU with Bluetooth 5 BLE radio connectivity functions and mainly targets the connected home, wearable, and industrial applications.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to the polysilicon layer
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process