Product Item Code
Logic - Process
The Advanced CMOS Essentials (ACE) deliverable for logic microprocessor chips with FinFETs comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
- Downstream product teardown
- Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
- Transmission (TEM) and (SEM) bevel through the logic region and SRAM
- TEM and SEM cross section of the general device structure, back end of line (BEOL) (metals, dielectrics) and front end of line (FEOL) structures
- Two TEM cross sections, orthogonal to the transistor gate fingers and fins showing the lower metals and dielectrics, transistor gates (NMOS and PMOS), fins, isolation, and other FEOL features.
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