
This report is a functional analysis (FAR) comparing the Broadcom BCM7335 to the previously analyzed Broadcom BCM7405 and contains the following detailed information:
- Package photographs, package X-ray, die markings, die photograph, and die photographs with annotated functional blocks and memories
- Measurements of vertical and horizontal dimensions of major microstructural features of the BCM7335
- Basic process comparison of BCM7335 vs BCM7405
- Scanning electron microscopy (SEM) cross-sectional micrographs of dielectric materials, major features, transistors, and plan-view micrographs of the part delayered to the metal 1 level of the BCM7335 and BCM7405
- Identification of major functional blocks of the BCM7335 and BCM7405