Product Code
PNA-1602-902
Release Date
Availability
Published
Product Item Code
QUA-QFE1035
Device Manufacturer
Qualcomm
Device Type
Antenna Switch Module
Qualcomm QFE1035 Antenna Switch Process Node Assessment with TEM Option
This report presents a Process Node Assessment, with additional transmission electron microscopy (TEM) analysis of the Qualcomm HG11-NH137 die found inside the Qualcomm QFE1035 package. The QFE1035 antenna switch component is a wafer-level chip-scale package (WLCSP) measuring 2.5 mm x 1.8 mm x 0.5 mm thick.
 

Make informed business decisions faster and with greater confidence

Start My Free Trial

 

The authoritative information platform to the semiconductor industry.

Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.