Latest Blogs and Commentary
Narrative - Smart Speaker and Displays Shipment and Installed Base Forecast for 88 Countries 2014–2031
Companion content delivers qualitative insights alongside smart speaker and display shipment, installed base, and household data across 88 countries.
Palm Vein Biometrics in Smart Locks
Palm vein recognition brings advanced biometric security to smart locks by capturing unique subdermal vein patterns for authentication.
onsemi NCP58921 650 V 50 mΩ GaN Switch with Driver Die Exploratory Analysis
onsemi NCP58921 integrates a 650 V GaN HEMT and silicon driver, delivering high‑performance switching for advanced power conversion designs.
Samsung Galaxy S26+ (SM-S947B) Mobile RF Architecture
RF architecture analysis maps Galaxy S26+ signal paths, detailing Exynos 2600 platform, modem, transceiver, and full antenna‑to‑RF connectivity.
Micron Y62E D1γ 16 Gb DDR5 Memory Peripheral Design Analysis
Micron D1γ 16 Gb DDR5 design analysis delivers deep insight into peripheral circuits, Gate and Metal layers, and advanced memory architecture.
Infineon IRS2875C REAL3 h-ToF Sensor Exploratory Analysis
Infineon IRS2875C is a HQVGA i‑ToF image sensor with 10.0 µm pixels, designed for consumer and industrial applications.
Micron Y62E D1γ 16 Gb DDR5 Memory Full Process Analysis
Analysis details Micron Y52E 16 Gb DDR5 DRAM die, examining array, peripheral structures, and materials through advanced imaging.
Market Data: Smart Speakers and Displays
Smart speaker and display market data tracks shipments, revenue, share, and outlooks across vendors, operating systems, and regions.
Market Data: Sensors
Sensor market data covers shipments, revenue, ASP, and forecasts across image, smartphone, and automotive sensors with vendor-level insights.
Market Data: Tablets
Tablet market data tracks OEM and OS competition with global shipment share, revenue, and forecasts across segments, pricing, and technology trends.
TSMC Leading Edge Wafer Pricing and Corporate Outlook - Module 2: 5nm Analysis
Analysis of TSMC 5nm, 3nm, and 2nm nodes as well as an overall corporate outlook extending out to 2035.
Q4 2025 Auto Chip Inventory Ratios Eased, But Device Trends Diverged Sharply
Inventory data from 11 semiconductor suppliers gives indications of easing Auto Chip Inventory.
Samsung ISOCELL HPE Exploratory Analysis
Exploratory analysis of The Samsung ISOCELL HPE, a 200 MP, 0.56 µm pixel pitch stacked back illuminated (BI) CMOS image sensor (CIS).
Qualcomm QCC743 Wi-Fi 6/BT 5.4/Zigbee/Thread Tri-Radio SoC Floorplan Analysis
Qualcomm QCC743 Wi-Fi 6/BT 5.4/Zigbee/Thread Tri-Radio SoC Floorplan Analysis 2 Min Read May 13, 2026 This report presents a Basic Floorplan Analysis of the Qualcomm die HG11-72035-1 found inside the Qualcomm QCC743 component. This summary outlines
DJI Mavic 4 Pro Main Camera Sensor (OmniVision 100 MP) Device Essentials Folder
DJI Mavic 4 Pro Main Camera Sensor (OmniVision 100 MP) Device Essentials Folder 2 Min Read May 13, 2026 Omnivision 100MP CIS in DJI Mavic 4 Pro highlights stacked BI sensor design, advancing high-end drone imaging for pro photography. The Omnivision
Company Earnings: TSMC
Company Earnings: TSMC 2 Min Read May 13, 2026 Report looking at TSMC'S quarterly earning. These reports provide key takeaways about TSMC's demand and supply from their quarterly earnings call. This summary outlines the analysis* found on the
Apple Q1 2026: Tim Cook's Handoff Begins with a Record Quarter and a Memory Cost Warning
Apple’s Q1 2026 results highlight record revenue, a CEO transition, MacBook Neo, and building pressures shaping the iPhone 18 cycle.
Motorola Signature (XT2603-1) Deep Dive Teardown
Deep dive teardown of The Motorola Signature includes detailed product disassembly analysis on unique construction, benchmarking, and cost data.