Add-On Products
Extend your TechInsights subscription with targeted intelligence
Add-on products extend your TechInsights subscription with specialized capabilities — from IC-level cost modelling to Scope 3 carbon accounting to HPC competitive analysis. Each integrates directly into your existing Platform access, deepening your team's intelligence without changing your core subscription.
1.5M+
Reports
100K+
Chip Teardowns
650+
Global Customers
30+
Years of Experience
Cost & BOM Intelligence
BOM Database
Three decades of component-level intelligence from TechInsights teardowns, in one searchable database. Understand what's inside competitor devices — and what it costs to build them.
- Detailed Bill of Materials for thousands of consumer electronics teardowns, including die and package cost by node size
- Supplier identification across IDMs and fabless manufacturers for competitive landscape mapping
- Informs internal cost targets, roadmap decisions, and procurement negotiation strategy
Handset Cost Model
A dynamic budgeting tool that lets you configure any handset specification and receive a full cost breakdown — BOM and beyond — updated quarterly as teardown data evolves.
- Configure chipset, display, cameras, memory, and connectivity to model total unit cost by tier and launch status
- Covers BOM costs and intangible costs: NRE, manufacturing, royalties, SG&A, R&D, and gross margins
- Forward-looking cost projections out to 18 months to support negotiation and launch planning
Semiconductor Manufacturing Economics
The industry-standard cost and price modelling suite for wafer fabrication, assembly, and test — built from the ground up with bottom-up process data across 300mm and beyond.
- IC cost and price models covering logic, DRAM, NAND, discrete, and power semiconductors, from 3µm to leading-edge nodes
- Fab database of over 1,000 global fabs with capacity, capital investment, and node-level detail from 2018 to present
- Negotiate with confidence: understand supplier margins and typical pricing practices before you go to the table
High Performance Computing
In-depth reverse engineering intelligence on the processors, chiplets, interconnects, and HBM architectures powering today's AI data centres. From the silicon up.
- Approximately seven comprehensive HPC teardowns annually: CPUs, GPUs, TPUs, DPUs, and networking hardware including chiplet-based and disaggregated SoC designs
- Detailed HBM floorplan analysis and advanced packaging coverage including TSV, hybrid bonding, fan-out, and silicon bridge implementations
- Independent performance, power, and thermal benchmarking using MLPerf workloads on fully configured AI servers — approximately two to four evaluations per year
- Inquiry access to TechInsights analysts for competitive context and strategic interpretation of findings
Memory Circuit Analysis
Transistor-level circuit extraction and analysis of leading-edge DRAM and NAND Flash, revealing the design decisions that drive density, performance, and manufacturing efficiency.
- Full circuit extraction on leading DRAM and 3D NAND architectures, including stacked and CMOS-under-Array (CuA) designs
- NAND internal waveform analysis capturing program, read, and erase cycles at the die level
- Advanced memory process analysis with next-node predictions and design-technology interaction insights
Sustainability & Carbon
TechInsights' sustainability add-ons form the EcoInsights suite — the industry's most comprehensive set of tools for calculating, reporting, and reducing semiconductor carbon emissions across Scope 1, 2, and 3. Each module can be used standalone or combined for end-to-end cradle-to-gate coverage.
Carbon Analyzer Module
A product-level view of carbon footprint across all ICs in a device — making it straightforward to benchmark semiconductor manufacturers and components on environmental impact.
- IC-level carbon footprint down to packaged component, grouped by general function and package type
- Simplifies competitive benchmarking of chip designers and fabs on key sustainability metrics
- Works in concert with the Manufacturing Carbon Module and Packaging & Carbon Module for full cradle-to-gate coverage
Manufacturing Carbon Module
The first model of its kind to quantify Scope 1, 2, and 3 emissions at the fab, wafer, and die level — across Logic, DRAM, NAND, GaN, and SiC processes globally.
- Coverage across 400+ fabs worldwide, with adjustable abatement factors by vendor, location, facility, and process
- Combines equipment types, process steps, and manufacturing inputs into a single integrated emissions model
- The foundational data layer that powers the full EcoInsights sustainability suite — meets Carbon Trust requirements for model assurance
Packaging & Carbon Module
Calculate the cradle-to-gate carbon footprint of any IC product in seconds — covering die manufacturing, packaging, and transportation across 30,000+ inventoried components.
- Single-click Scope 2 and 3 reporting for 29,000+ IC products across consumer, enterprise, and automotive applications
- Covers 780+ assembly processes and 124+ pre-configured package types, including 3DIC and advanced SoC packaging
- Built for external reporting and RFP responses — aligned to ISO 14067 and Carbon Trust assurance requirements
Market Intelligence
A comprehensive view of the semiconductor value chain. End markets, technology verticals, and manufacturing dynamics unified in a single authoritative subscription.
- Covers logic, memory, sensors, power, and more across automotive, mobile, consumer electronics, and data centre end markets
- Includes the McClean Report: the semiconductor industry's most respected annual market overview and long-term forecast
- Joins technical and industry verticals for coverage no standalone market research service can match
Full Coverage from Silicon to Market
Not sure which add-ons fit your subscription? Speak with a TechInsights specialist. We'll map the right capabilities to your segment, your team's workflows, and your strategic priorities.
