Featured Report Analysis
Component Price Landscape (CPL) Biweekly Update - Discrete Semiconductors and Passives
Discrete Semiconductors and Passives categories price decrease trend continued in Q1 2024 and is expected come to an end is Q2. We anticipate prices to increase in 2H 2024 for both segments. Lead times are expected to be relatively flat in most categories throughout 2024 except for discrete and passives components.
Report Overview: Three Cool Things Samsung Record High ASP
Learn more about why Samsung’s models are gaining traction and developing nations as well as why an overall decline in revenue and shipments from last year doesn’t tell the full story on Samsung’s outlook for 2024 and beyond.
Introducing TSMC N3E As Seen In Apple M4 SoC
TechInsights shares preliminary results of the Apple M4 analysis on design blocks like GPU and CPU, featuring 2-1 finFLEX and 3-2 finFLEX libraries, respectively. Dive into our on-going analysis and discover the measurements of critical dimensions of TSMC’s 3nm 2nd generation process node: the N3E technology node.
Qualcomm Snapdragon 8 Gen 3 Digital Floorplan Analysis
The Qualcomm Snapdragon 8 Gen3 (SM8650) application processor found in the Xiaomi 14 Pro 5G handset, features a CPU cluster composed of eight cores - this time swapping some efficient CPU cores for more powerful mid-size cores (vs the Snapdragon 8 Gen2).
Smartphone Image Sensor Market Share Q1 2024: Demand Drives Volume Growth
The smartphone image sensor market experienced a growth of 5% in Q1 2024. The recovery in the end-market boosted the orders of high-resolution CIS products to meet the smartphone specification demand.
Smartphone Image Sensor Shipments by CIS Model with Specifications: Q1 2024
The global smartphone image sensor market registered over 7% unit growth in Q1 2024. The growth was supported by the revival in market demand, driving the stocking of CIS for customer's new smartphone products. GalaxyCore GC02M1 series dominated shipments followed Samsung S5KJN1 series and Sony IMX714 series, together claiming over 180 million units shipped during the quarter.
Forecast: Automotive Semiconductor and Sensor Demand
This global forecast covers historical and future semiconductor and sensor demand for the automotive industry in USD and units. In 2024, automotive semiconductor demand is forecast to grow by 13% in USD to reach $80 billion; unit growth is expected at 7% surpassing 113 billion.
Survey Plus Teardown of the Tecno Spark Go 2024 BG6 Smartphone
The Tecno Spark Go 2024 BG6 is one of the latest Tecno smartphones. This device is one of the latest variants from Tecno Spark Go line and the successor to the Tecno Spark Go 2023.
Deep Dive Teardown of the Amazon Echo Show 8 3rd Gen R855D6 Smart Display
The design wins for the Amazon Echo Show 8 3rd Gen is divided between different manufacturers. The application processor comes from Amlogic while WiFi Front-end comes from Mediatek. As for the memory, SK Hynix provided 2 GB LPDDR4 SDRAM and Samsung provided 8 GB MLC NAND flash.
GalaxyCore GC32E1 Standard Floorplan Analysis
The ISP from the periphery region of the Galaxycore GC32E1, a back-illuminated (BI) CMOS Image Sensor (CIS) for mobile cameras, was extracted from the Tecno Spark 20 front camera.
Canon LI5030SAC Device Essentials Folder
The Canon LI5030SAC is a Bayer color, 6.4 μm, front-illuminated (FI) charge domain global shutter (GS) full frame (FF) CIS for machine vision applications, acquired as a standalone part.
Survey Plus Teardown of the Samsung A35 5G SM-A356E/DS Smartphone
The Samsung A35 5G is equipped with the Samsung Exynos 1380 processor, while its predecessor, the Samsung A34, offers the Mediatek Dimensity 1080. The Samsung A35 5G offers 6, 8, and 12 GB of RAM, while the Samsung A34 5G can be equipped with 4, 6, or 8 GB RAM.
Q1 2024: Honor: Topped China and Solid Progress in Overseas Market
Driven by the growth in both overseas and China market, Honor’s global smartphone shipment increased 34% YoY to 17.0 million units. It also took the leadership in China this quarter. Solid progress in overseas markets has been made with record higher contribution this quarter since the split from Huawei. Despite a slight fall on average selling price (ASP), Honor posted significant annual revenue growth in Q1 2024.
Samsung K9AHGD8J0C 133L 512 Gb TLC 3D NAND Memory Floorplan Analysis
Analysis of the floorplan design used in the SAMSUNG K9AHGD8J0C (V9 PRIME Die) 133L 512 Gb TLC 3D NAND and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets. Process node and foundry identification, critical dimensions, memory and periphery functional block summaries and die/package cost analysis are provided.
Towering Memory: HBM and Verticality
The artificial intelligence (AI) arms race continues with key players AMD and Nvidia announcing competing products. The scale of deployments continues to expand, and the volume of required hardware is straining the supply chain and spurring new investments in advanced packaging production capacity.
Embedded Memories in PMICs – ReRAM and SONOS Memory Observations in Recently Analyzed Devices
Exploratory analysis results of a first ReRAM observations in a PMIC device: STMicroelectronics’ STWLC38 wireless charging receiver IC, including the process node and process type determination and a first look of the ReRAM structure.
Deep Dive Teardown of the Meta Quest 3 S3A VR Headset
Compared to the previous generation VR headset, the Oculus Quest 2, the Meta Quest 3 features upgraded hardware components. This includes a more powerful processor for improved performance, enhanced display technology for better visual fidelity, and upgraded tracking sensors for more accurate motion tracking.
Embedded & Emerging Memory Technology Roadmap – May 2024
The Memory Embedded and Emerging memory technology roadmap has been updated. Recently, industry leading emerging memory players such as TSMC, GlobalFoundries, Samsung, UMC, Fujitsu, Sony, Renesas, Everspin, and Avalanche introduced and revealed commercial STT-MRAM and ReRAM products used for the embedded memory applications.