Samsung K9AHGD8J0C 133L 512 Gb TLC 3D NAND Memory Floorplan Analysis
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Analysis of the floorplan design used in the SAMSUNG K9AHGD8J0C (V9 PRIME Die) 133L 512 Gb TLC 3D NAND and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets. Process node and foundry identification, critical dimensions, memory and periphery functional block summaries and die/package cost analysis are provided.
