Towering Memory: HBM and Verticality
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The artificial intelligence (AI) arms race continues with key players AMD and Nvidia announcing competing products. The scale of deployments continues to expand, and the volume of required hardware is straining the supply chain and spurring new investments in advanced packaging production capacity. As a key piece of these systems HBM is being propelled forward, and upwards. Manufacturers are targeting 16-die high DRAM stacks for HBM4, but finding enough vertical space is a challenge.
