IoT Connectivity SoC H2 2023 Briefing
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IoT Connectivity SoC 2023 H2 Briefing - Wireless technology beyond smartphones: design trends and opportunities with WLAN for smart applications and iIoT/C-IoT.
Explore the latest trends in the semiconductor industry, including the rise of silicon photonics, edge AI chip impact, and advanced packaging innovations, with expert insights and forecasts.
Inside the Future of Wearables | Teardown Insights & Market Trends eBook
Discover what's powering next-gen wearables. Get teardown insights, sensor trends, and strategic analysis in our free TechInsights eBook—built for tech leaders.
Huawei Matebook Fold Uses Kirin X90 Built on SMIC’s 7nm (N+2) Node
TechInsights confirms Huawei's Matebook Fold | Ultimate Design features the Kirin X90 SoC built on SMIC’s 7nm (N+2) process—debunking rumors of a breakthrough 5nm node.
The Authoritative Information Platform to the Semiconductor Industry.
