The DEF includes observed device metrics and salient features supported by the following unannotated image folders:

• Downstream product teardown
• Package X-rays, die photograph, non-invasive optical photos of die features
• SEM images of the pixel array delayered to the metal, transistor, and diffusion levels
• Exploratory cross-section SEM imaging of the general pixel array and peripheral structures

This deliverable provides basic competitive benchmarking information and enables cost-effective tracking of multiple competitors’ technology.