Latest Blogs and Commentary
AI's Influence on Advanced Packaging: Mid-Year Briefing Highlights and Innovations
Topics covered include TSMC’s recent announcements of an expanded technology offering for system-on-wafer (SoW) and new targets supporting continued interposer scaling in 2.5D chip-on-wafer-on-substrate (CoWoS) technology that is underpinning the AI boom.
Apple Vision Pro: Revolutionizing Face ID with TrueDepth Technology
Spatial computing integrates a user’s virtual environment with their physical surroundings, and Apple's Vision Pro achieves this with a suite of advanced sensors. While LiDAR, or Light Detection and Ranging, plays a significant role in mapping the user's space, the TrueDepth camera system adds another layer of depth sensing.
Samsung Galaxy Watch 7
Discover the Samsung Galaxy Watch 7 with TechInsights. Explore the latest Exynos W1000 processor, advanced health tracking, AI wellness tools, and our detailed technical analysis.
Samsung Exynos W1000 Processor
Get an in-depth first look at the Samsung Exynos W1000 processor in the Galaxy Watch 7 Series. Discover the 3nm gate-all-around process, critical dimensions, and upcoming detailed analyses on TechInsights.
Sustainability at SEMICON West 2024: Achieving Sustainable Growth in the Semiconductor Industry
SEMICON West recently wrapped up, and one of the notable programs focused on sustainability, which provided a platform for sharing insights, innovative solutions, and collaborative strategies to address environmental challenges.
Taking Monolithic Designs to Disaggregation
The term ‘chiplet’ has come into use to describe an evolved design strategy moving past monolithic system-on-chip (SoC) to the heterogeneous integration of a disaggregated design in a system-in-package (SiP).
Chiplet Technology: Disrupting Chip Design and Fueling Growth
The semiconductor industry is facing a turning point with the rise of chiplet technology (also known as chiplet-based design or semiconductor chiplet technology). This revolutionary approach has been made possible by the advances in chip-to-chip interconnect and is poised to reshape chip production and design, particularly within the computing segment.
America's Chip Suppliers Continue to Dominate R&D Spending
Despite political and national security concerns about US domestic semiconductor production, American companies continue to account for more than half of the global chip industry’s total spending on research and development, according to the latest annual analysis of R&D expenditures by TechInsights.
Lunar Lake Packs Big Efficiency Boost
Intel’s Lunar Lake, the biggest overhaul of its architecture for PC processors since the addition of efficiency cores with Alder Lake, promises a big leap in power efficiency that may nullify AMD’s long-standing advantage in this metric.
Apple R1 Adopts TSMC’s Latest Package
Apple’s R1 sensor hub chip in the Vision Pro AR/VR headset is the first use that TechInsights has seen of TSMC’s InFOM advanced packaging technology. The R1 has a 5nm processor chip plus two LLW DRAMs linked by short very-high-density interconnect to speed up the data processing.
LiDAR Technology in Apple Vision Pro
Spatial computing is a highlight of the new Apple Vision Pro headset. This device uses various sensors to integrate virtual and physical environments by sensing the three-dimensional structure of the user's space and eye movements.
The Chip Observer (June Edition)
Dive into the latest Chip Observer for June 2024! Explore major advancements in AI PCs, competitive shifts in datacenter GPUs, and insights on the recovering memory market. Discover how NVIDIA’s dominance is being challenged and get the scoop on IBM’s strategic moves.
Samsung Foundry's Next-Gen GAA Process Expected in Galaxy Watch 7
Discover the latest innovation from Samsung Foundry with their next-gen GAA process expected in the Galaxy Watch 7. TechInsights analysts provide insights from the Samsung Galaxy Unpacked Conference, building on last year's groundbreaking SF3E process technology.
Volkswagen's $5 Billion Rivian Investment
Discover how Volkswagen’s $5 billion investment in Rivian could reshape its CARIAD software division, boost Android Automotive OS adoption, and influence future EV developments.
AI Memory Supply Chain Is Still Lagging Demand
Semiconductor equipment order activity held at 87 °F last week. Memory remains the hottest segment. Advanced packaging continues gaining traction as the supply for AI is still catching up to demand.
Logic IC Sales Up 15% YoY the week ending June 21, 2024
Semiconductor sales increased 5% last week and were up 27% from this time last year. TechInsights forecasts Logic IC sales will increase 16% to $324 billion in 2024.
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