Product Item Code
Power Management IC
Power Semiconductor - Power Essentials
This report presents a Process Review of the TSMC 0.13 µm bipolar-CMOS-DMOS (BCD) process found in the Qualcomm PMI632 power management integrated circuit (PMIC) device. The PMI632 is packaged using wafer-level chip-scale packaging (WLCSP).
Get regular, succinct analysis of emerging power process semiconductor products
Fact-based analysis of emerging power semiconductor technologies using Gallium Nitride (GaN) and Silicon Carbide (Sic), and innovative, competing use of Silicon (Si).