Silead PBEM00 Optical Fingerprint Sensor from the Oppo R17 Basic Functional Analysis

Product Code
FAR-1810-806
Release Date
23/11/2018
Availability
Published
Product Item Code
OPP-PBEM00_Fingerprint-Sensor_die
Device Manufacturer
OPPO
Device Type
Finger Print Sensor
Report Code
FAR-1810-806
This report presents a Basic Functional Analysis of the Silead PBEM00 fingerprint sensor die found inside the Silead PBEM00 fingerprint sensor package.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision Software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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