This report will analyze the construction, materials and processes used to fabricate the Sony ISX014 stacked CIS. The ISX014 is a 3D interconnected System-in-Package (SiP) image sensor and image processor all combined into one. Fundamentally, it is an 8 Mp back side imager connected to the image processing engine through the use of Cu TSV's. This report will examine the sensor using SEM, TEM, and materials analysis in both planar and cross-sectional views. A representative sample table of contents is provided here for review.