すぐにご活用いただける幅広いコスト計算データ
コスト計算/デザインウィンデータベースには、30 年にわたり蓄積されてきたテックインサイツが行ったティアダウン解析の半導体データが収められています。
テックインサイツが行ってきた多様なモジュール、2,000 点以上の製品、20,000 点以上の IC を素早く検索できます。 このアプリケーションでは、総合的なフィルタリングおよび検索機能により、対象の部品を素早く見つけて比較できます。
デザインウィン情報についての洞察
広範かつ詳細な IC コスト計算データ
革新的な設計機能、サプライチェーンの関係性
確かな事実に基づく意思決定の向上
コスト計算/デザインウィンデータベースで実現すること:
- 高収益製品におけるデザインウィンの判断
- サプライチェーンの関係性を育む競合情報の収集
- デバイスや製品の分野における技術トレンドの探索
- 特定の製品やシステムに関する幅広い BOM のエクスポートおよび解析
- 広範な IC コスト計算データへのアクセス
- 競合におけるポジショニング、技術的な選択肢、研究開発戦略、知的財産の位置付け、市場機会についてのコスト効率が高く、迅速で優れた意思決定
主な特長
- 視覚的: IC 評価機能は、コスト計算データを視覚的に表示し、選択した製品について比較/対比がひと目でできるようになっています。
- インタラクティブ: 検索ボックスにより、IC またはシステムの多様な条件を設定して、フル検索または部分検索を行うことができます。ネスト構造のフィルター機能を使用して検索結果を絞り込み、カギとなる関連データセットを生成することもできます。
- 関連性: システム/パッケージ/ダイとコンポーネント間の接続の関係を正確に把握し、相互に関連した多数のコンポーネントとデバイスを視覚化できます。
必要なデータに迅速にアクセス
サブスクリプションをご契約いただきますと、必要な情報をすぐに入手できます。高速な検索エンジンを用いて、最新のティアダウンデータにアクセスでき、画像やレポートを表示またはダウンロードして、製品を比較し、部品とデバイスの関係も確認できます。テックインサイツのティアダウンサブスクリプションでは、いつでも最新のティアダウンデータにアクセスしていただけます。
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IP Corporate Strategy Summit
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ESSDERC/ESSCIRC 2019
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