Featured Report Analysis
MeiG SRM813Q 5G Red-Cap Deep Dive Teardown
Discover the MeiG SRM813, a 5G reduced-capacity wireless module for limited connectivity areas. It supports fewer frequency bands than the Quectel RG255C-GL but operates on the Qualcomm Snapdragon X35 platform.
McClean Report October 2024: Pure-Play Foundry Leaders and Forecast
Explore the semiconductor foundry market, which declined 13% in 2023 to $124 billion but is set to rebound with 19% growth projected for 2024. The “Big 4” foundries—TSMC, UMC, GlobalFoundries, and SMIC—accounted for 87% of total sales.
AI Client Computing Processors Market Share - Q3/24 update
Explore the booming AI processor market, with over $2 billion in NPUs shipped in Q2/24—up 2.5X year-over-year. Apple leads with 47% market share, while Intel follows with 40%. Expect ongoing growth in AI PC processors throughout 2024!
Market Data 2024 Q3 Automotive Semiconductor Capacity, Shipments, Utilization Short Term Forecast
Stay updated on the automotive device market, with no capacity constraints through early 2025. However, watch for potential undersupply risks for automotive processors and ASICs in late 2025, along with power semiconductor challenges by late 2026.
Smartphone Display Panel Market Share Q2 2024: Samsung Achieves Top Spot and Captures Over 50% Share
Dive into the Q2 2024 smartphone display panel market report, highlighting over 10% year-over-year growth driven by rising OLED demand. Discover insights on global shipments, revenue, and panel trends from leading vendors like Samsung Display, BOE Technology, and LG Display.
onsemi AR2020, 1/1.8”, 20 MP, 1.4 µm Pixel Pitch Stacked Back-Illuminated CMOS Image Sensor HyperluxTM LP Technology
Explore the onsemi AR2020 image sensor with Hyperlux™ LP technology, offering low power and enhanced NIR response for machine vision, AR/VR, and biometrics.
Global Handset Sales Forecast by 88 Countries and 19 Technologies up to 2029
Discover our in-depth report on global handset sales, forecasting trends for 6 regions and 88 countries through 2029. It covers the rise of 5G, the decline of LTE, and forecasts for 19 technologies with detailed data for analysis.
SmartSens SC535HGS (3rd Gen Global Shutter) Device Essentials Folder
Explore the SmartSens SC535HGS 4.0 MP CMOS image sensor, featuring VDGS and SmartGS®-2 Plus technology for enhanced low-light performance and up to 78dB dynamic range.
TSMC’s Embedded Resistive Random-access Memory (eReRAM) Technology
Explore TechInsights' latest reports on TSMC-fabricated eReRAM devices, showcasing cutting-edge memory technology and integration methods.
Antenna-in-Package (AiP) Technology for 5G and beyond: A Comparative Analysis of Advanced Modules from Flagship Devices (Qualcomm, Murata, USI, MediaTek)
Discover the latest in Antenna-in-Package (AiP) technology for 5G and beyond. This report compares advanced AiP modules from Qualcomm, Murata, USI, and MediaTek, showcasing innovations in wireless packaging.
2025 Memory Outlook Report
Discover the key trends shaping the memory market in 2025, including AI impacts on HBM and NAND growth. Stay informed with essential insights and forecasts.
2025 Advanced Packaging Outlook Report
Discover key insights from the Advanced Packaging Outlook Report 2025, covering trends like interposers for AI, Panel-Level Packaging (PLP), automotive chiplets, silicon photonics, and glass substrates, driving the future of semiconductor packaging.
Zentel PSMC 25 nm 4 Gb DDR4 DRAM Advanced Memory Essentials
Unlock critical insights into Zentel PSMC A3F4GH40ABF 25 nm 4 Gb DDR4 DRAM with our Advanced Memory Essentials (AME) report. Includes TEM-EDS, TEM-EELS results, key device metrics, and detailed SEM/TEM imaging. Perfect for semiconductor memory analysis.
Highlights from European Microwave Week
Explore the key highlights from last week's European Microwave Week in Paris. Over 4,000 attendees, 300 exhibitors, and three major conferences covered the latest in RF and microwave technology, with workshops and forums on automotive, 6G, and Aerospace & Defense.
Samsung Shannon 5730 FR2 IF Transceiver Die Floorplan Analysis
Explore insights on the Samsung Shannon 5730 die, found in the FR2 IF transceiver from the Google Pixel 9 smartphone.
YMTC 160L 512Gb TLC 3D NAND - Xtacking 4.0 Floorplan Analysis
Explore this comprehensive report analyzing the floorplan design of the YMTC 160L TLC 3D NAND – Xtacking 4.0. It includes detailed imaging sets, process node identification, and die/package cost analysis.
Tracker: China Smartphone Shipments & Marketshare by Model: Q2 2024
Uncover the top 100 best-selling smartphone models in China for Q2 2024. Explore the success behind leading brands like Apple, Honor, Oppo, Vivo, Xiaomi, and more in the world’s largest smartphone market.
STMicroelectronics VG1762 Device Essentials Folder
Discover the in-depth analysis of STMicroelectronics’ VG1762 CMOS image sensor (CIS) with 2.3 MP resolution and 1/2.5” optical format. Learn about its high dynamic range (HDR), ultra low-noise performance, and NIR optimization.
