NVIDIA Blackwell B200 Processor Floorplan Analysis
2 Min Read May 15, 2025
A floorplan analysis of NVIDIA’s GB102 GPU die in the GB100-886N-A1 package, found in the HGX B200 AI accelerator, successor to the Hopper H100/H200 series.
A Processor Floorplan Analysis of the GPU die GB102-A01 found inside the NVIDIA GB100-886N-A1 package. The GB100-886N-A1 package was removed from a NVIDIA HGX B200 accelerator cluster found in a Supermicro SYS-A22GA-NBRT GPU SuperServer. The HGX B200 is NVIDIA's artificial intelligence (AI) datacenter accelerator. It includes eight NVIDIA Blackwell GB100 GPU packages and two Intel Xeon 6 6900 'Granite Rapids' central processor units (CPUs). The GB100-886N-A1 package directly replaces NVIDIA's popular Hopper H100/H200 series products, which currently form the backbone of the world's installed AI training capabilities.
The GB102-A01 die incorporates 208 billion transistors, which is 2.5× more than the Hopper GPU die and delivers the highest ever computing power of 20 petaflops on a single chip. The two dies are connected and unified with a single 10 terabyte-per-second (TB/s) chip-to-chip NVIDIA High-Bandwidth Interface (NV-HBI) to provide one fully coherent GPU
