お問い合わせの種類
営業部門による早急な対応を必要とする販売関連のお問い合わせ
ご契約中のテックインサイツのサブスクリプションに関するカスタマーサポートへのお問い合わせ
テックインサイツの技術および特許サービスに関するメディアからのお問い合わせ
| 知財サービス | 技術情報 | |
|---|---|---|
| 米国 | Ian MacLean 1-613-576-0249 |
Tina Newhook 1-877-826-4447 (内線 3517) |
| EMEA/インド | Danny Thomas 44-1276-452624 |
Danny Thomas 44-1276-452624 |
| 日本 | 栄谷哲也 03-6869-7700 |
栄谷哲也 03-6869-7700 |
| 韓国 | Hansen Hong 82 10 3178 2036 |
Hansen Hong 82 10 3178 2036 |
| 中国/台湾 | Julian Chen 886 982 236 843 |
Cindy Lin 86 18411038727 886 917188481 |
本社
本社
TechInsights Inc.
1891 Robertson Road, Suite 500
Ottawa, ON K2H 5B7, Canada
テックインサイツジャパン株式会社
〒100-0011
東京都千代田区内幸町 1-1-1
帝国ホテル本館
6 階 614 号室
TechInsights Warsaw
Ul. Taneczna 18c
Warsaw, Poland
Latest Posts From Our Blogs
Hybrid Bonding Technology - 2023 and beyond
Recently, TechInsights hosted a webinar where several experts from our Logic, Image Sensor, Memory, and Engineering teams reviewed applications of hybrid bonding technology and discussed what’s to come in 2023 and beyond.
Join TechInsights’ Leading Market Analysts at the 2023 Mobile World Congress
Leading market and technology analysts from TechInsights will be attending the Mobile World Congress (MWC) in Barcelona, Spain Feb. 27 – Mar. 2, 2023. During the event, our analysts will conduct business meetings, moderate conference sessions, attend briefings and provide media interviews.
Power of the Chip Series
This short-form video series will cover topical events and include insightful commentary from our TechInsight’s experts (and surprise guests) on how powerful this tiny object is.
Lithography: Now and Then
Advanced lithography techniques, which are required to print ultrafine features on to chips, are primary enablers of modern technology advancement. There are many different lithographic techniques, with EUV considered the modern-day frontrunner leading the way to the world’s most advanced chips.
Throwback to 2021 CIS Technology Trends
CMOS image sensors (CIS) have continued to evolve in response to performance requirements of current applications of Smartphone Imaging, Security Surveillance, Biometrics, Automotive and Depth Sensing and Ranging.