STMicroelectronics ISP Die from VB56G4A 1.5 MP Resolution 2.61 μm Pixel Pitch CIS Camera Module Standard Floorplan Analysis

STMicroelectronics ISP Die from VB56G4A

 
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This report presents a standard floorplan analysis (FAR) of the STMicroelectronics ISP Die from VB56G4A 1.5 MP resolution, 2.61 μm pixel pitch CIS camera module.

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