Samsung Exynos 2600 Mobile SoC PoP with FO-WLP and Heat Path Block Packaging Technology - Advanced Packaging Essentials

APE report details Samsung Exynos 2600 packaging innovations, highlighting redesigned FO‑WLP with Heat Path Block technology and improved thermal management.

This is an Advanced Packaging Essentials (APE) report, which provides deep insight into the advanced packaging innovations used in the manufacturing of the Samsung Exynos 2600 mobile system-on-chip (SoC) device. With the Exynos 2600, Samsung has redesigned its fan-out wafer-level packaging (FO-WLP) and added a heat spreader, in what it calls Heat Path Block (HPB) technology. The newly designed package has a reduced DRAM package footprint, repositioned laterally, allowing a copper-based thermal block to be placed alongside the DRAM package, while continuing use of both bottom and top fan-out redistribution layers.