Qorvo Power Amplifier Die 3 (QM77050) RFIC Process Analysis

2 Min Read February 17, 2026

This report analyzes Qorvo’s QM77050 RFIC power amplifier die from the Honor X70 5G, a LB/MB/HB front‑end module integrating SoC and RF parts in one package.

This report presents an RFIC process analysis on the Qorvo QM77050 power amplifier die 3, 02QM7705164, found inside the Qorvo QM77050 - RF Module. The QM77050 component was extracted from the Honor X70 5G handset. The QM77050 component is a low-band/mid-band/high-band (LB/MB/HB) Front-End module that embeds the Qorvo SoC and the RF front-end components within the same package.

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