Micron D1β LPDDR5X DRAM Transistor Characterization Report
This report presents Key DC characteristics for NMOS and PMOS transistors located in the word line drivers and sense amplifiers regions of the Micron Technology Y52P die found inside the Micron Technology MT62F1G64D4AM-031_XT_C LPDDR5 SDRAM component. The Micron Technology MT62F1G64D4AM-031_XT_C is a package-on-package (PoP) module containing LPDDR5 SDRAM package on top of the main application processor package in the Apple iPhone 15 Pro smartphone.
The Apple iPhone 15 Pro is Apple’s newest flagship smartphone, launched September 22, 2023. The Apple iPhone 15 Pro measures 146.6 mm × 70.6 mm × 8.3 mm and weighs 187 g. The phone features face ID, gyro, proximity, accelerometer, barometer, Ultra-Wideband 2 (UWB) support and emergency SOS via satellite. The Apple iPhone 15 Pro is powered by the A17 Pro APL1V02 application processor, a 64-bit ARM based system-on-chip (SoC) designed by Apple and manufactured by TSMC using TSMC’s 3 nm FinFET process, packaged with four Micron MT62F1G64D4AM-031_XT_C 16 Gb LPDDR5 SDRAM Y52P dies, manufactured using Microns D1β DRAM CMOS process. The 16 GB LPDDR5 SDRAM Y52P die measures 7.02 mm × 5.24 mm (36.78 mm2) as measured from the die seals, or 7.07 mm × 5.30 mm (37.47 mm2) for the full die. The die was manufactured using Microns D1β DRAM CMOS process incorporating seven back-end of line (BEOL) interconnect layers (two tungsten (W), four copper (Cu), one aluminum (Al)) and one Al redistribution layer (RDL), BL under capacitors, and a buried WL forming the gate of the buried cell array transistor (BCAT).
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