ams OSRAM ISP Die from Mira220, 2.2 MP Resolution, 2.79 μm Pixel Pitch Stacked Back-Illuminated NIR Enhanced Voltage Domain Global Shutter CMOS Image Sensor Standard Floorplan Analysis
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This report presents a standard floorplan analysis (FAR) of the ams OSRAM ISP Die from Mira220, 2.2 MP Resolution, 2.79 μm Pixel Pitch Stacked Back-Illuminated NIR Enhanced Voltage Domain Global Shutter CMOS Image Sensor. A back-Illuminated G/S sensor with high Q/E in the NIR allowing low power operation, applicable for ranging (2D/3D) for AR/VR, wearables, robotics and drones.
