3D NAND – Q2 2023 Update

3D NAND – Q2 2023 Update

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Chi Lim Tan, Senior Process Analyst and NAND expert with TechInsights, has compiled a quick review of major happenings in the second quarter of 2023. Read about newly available or newly announced products and additional insights into products we have been examining:

  • Samsung 236-Layer TLC
  • SK hynix 238-Layer TLC
  • Solidigm 192-Layer QLC
  • KIOXIA/Western Digital 218-Layer TLC/QLC, which will use hybrid bonding – in this case, CMOS directly bonded to array (CBA)
  • Micron – further insights into their 232-layer TLC
  • YMTC – further insights into their 128-layer QLC
  • TEL’s novel chemistry cryo process for memory hole etch


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