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Taiwan Earthquake Expected to Have a Short-Term Impact
In the wake of Taiwan's recent earthquake, the semiconductor industry stands resilient, with only short-term disruptions anticipated. Our thoughts are with those affected by this natural disaster, which has garnered attention as the most intense earthquake in Taiwan over the past 25 years.
Taiwan Earthquake and the Semiconductor Industry
Discover the aftermath of the Taiwan earthquake on the semiconductor industry and global supply chains. Learn how major players like TSMC are navigating disruptions while prioritizing safety.
Taiwan Earthquake: Billion-Dollar Data Center Fallout
A recent earthquake in Taiwan has disrupted industries, including the data center market, raising concerns about supply chain stability.
DRAM Scaling and Maximum Memory Capacity
Discover the latest advancements from industry leaders Micron, Samsung, and SK hynix, and gain insights into the future of technology.
2023 Automotive Semiconductor Vendor Share: STMicroelectronics Closing in on NXP and Infineon
The automotive semiconductor landscape in 2023 showcased Infineon and NXP retaining their top positions, with Infineon widening its lead over NXP.
Huawei's Q4 2023 Resilience in China Market
Despite facing stiff competition from Apple in the mid- to premium-tier segments, Huawei's performance during China's 11.11 online shopping festival solidified its position as a top contender.
Micron Q1 2024 (FY Q2 2024) Report Summary
Discover the highlights of Micron's Q1 2024 report, showcasing impressive growth and strategic advancements in the semiconductor industry. Gain insights into Micron's market outlook and innovative initiatives shaping the future of semiconductors.
DRAM IC Sales Up 81% YoY the week ending March 22, 2024
Semiconductor sales were down 2% last week but increased 19% from this time last year. Zooming in on DRAM IC, the 13-week MA jumped 81% YoY last week.
Renesas, TSMC Embed Fast MRAM
Renesas and TSMC demonstrated two uses of fast MRAM at ISSCC. Renesas targets faster NVM; TSMC targets working memory. Their tradeoffs are very different.
ST Introduces Its First 64-Bit SoCs
The STM32MP2 devices integrate up to two Cortex A35 CPUs with a substantial number of I/Os for embedded industrial applications.
AI Notebook PC Forecast: 95% AI-Capable Shipments by 2029
AI-capable notebook PCs– defined as a notebook PC that ships with a dedicated chipset built specifically to accelerate AI computing on device (i.e. an NPU) –will represent 95% of the total notebook PC market, or 230.5 million units, shipped in 2029.
Samsung Dominates Latin America's Smartphone Market: Q4 2023 Breakdown
In Q4 2023, Latin America's smartphone market experienced significant growth driven by economic improvements, festive occasions, and the introduction of new Apple iPhone models.
NVIDIA's Blackwell Platform: Powering AI with Advanced Electronics
NVIDIA's unveiling of the Blackwell Platform at GTC 2024 has sparked industry-wide excitement, showcasing the company's prowess in AI computing.
Automotive Market Outlook Webinar Series
Anticipate and adapt to automotive semiconductor landscape changes with market projections, emerging tech insights, and key demand drivers. Gain valuable foresight now.
Apple iPad Model Tracker 4Q 2023: Big Changes Expected in 2024 Refresh
Apple is rumored to launch new iPad Pro models with the M3 chip and even new iPad Air models in late March 2024, kicking off a year of iPad updates. These will be important updates to Apple’s portfolio and should be cast in the new light of what is possible with on-device AI to reinforce the messaging that iPads are PC replacements as well as entertainment devices.
Unlocking Insights: First PMIC Video Briefing of 2024 Released!
In this briefing we focus in depth on a highly integrated PMIC designed for multi-port charging applications from Infineon, the CYPD7271-68LQXQ. It incorporates an ARM® Cortex®-M0 32-bit MCU, 128 KB Flash, 32 KB ROM, 16KB SRAM and power devices all on a single die with the embedded flash observed to be a silicon-oxygen-nitrogen-oxygen-silicon (SONOS) design.
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Huawei Mate 60 Pro Mobile RF Architecture Proves They Can Compete with Top-Tier Smartphone OEMs
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