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Hybrid Bonding Expands from Image Sensors to Logic, Memory - Image Sensor, Logic & Memory TechStream Blog

Dick James, Fellow Emeritus Dick James is an almost 50-year veteran of the semiconductor industry, working in the process development, design, manufacturing, packaging and reverse engineering of semiconductor devices. Dick is a regular contributor to TechStream blog content for subscribers

25Sep

Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G chip design and manufacturing

Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G transceiver design and manufacturing

Space, Power, BEAMs Shorten the trek to gain the edge in 5G transceiver design and manufacturing The Mobile RF landscape has become more competitive with the introduction of 5G, complemented by relevant innovation aimed at addressing varying complexity challenges. Regarding 5G mmWave transceivers

23Sep

DRAM, 3D NAND Face New Challenges

Semiconductor Engineering - Various memories and business outlooks are all over the map, sometimes literally, with lots of confusion ahead.

21Sep

SK hynix 128L 3D PUC NAND (4D NAND)

SK hynix has released the world’s first 128-layer (128L) 3D NAND, which they have termed 4D NAND. This is their second NAND generation built using Periphery Under Cell (PUC) architecture; the first was their 96L NAND. In PUC architecture, peripheral circuits are stacked under the cell, resulting in

14Sep

Inside the Intel RealSense L515 LiDAR Camera

Introduction The world of LIDAR sensing is evolving. Rotating turret LiDARs are commonplace for applications such as autonomous driving (see our Automotive LIDAR teardown subscription), but they are being displaced by a new generation of solid-state laser scanning LiDAR technology. Of particular

11Sep

Webinar: ALD/ALE Process in Commercially Available Logic Devices

ALD/ALE Process in Commercially Available Logic Devices 2018 saw the introduction of a new generation of logic products featuring finFET transistors headlined by Intel with their 10 nm generation microprocessor, followed by TSMC and Samsung towards the end of the year with their 7 nm node devices

09Sep

Webinar: ALD/ALE Process in Commercially Available Logic Devices

26Aug

Samsung S5K33D i-ToF with 7 µm Pixel Global Shutter in House

Samsung S5K33D i-ToF with 7 µm Pixel Global Shutter - Image Sensor TechStream Blog

Ray Fontaine, Product Manager – Image Sensor Ray is one of the preeminent image sensor technology experts in the world, and he regularly publishes Image Sensor analysis content and commentary for TechInsights subscribers. August 12, 2020 Our teams have sourced the Samsung 640 x 480 indirect time-of

12Aug

60 years of the Semiconductor industry and its changing patent strategy

Contributed by: Arabinda Das Today the semiconductor industry is a behemoth whose annual sales revenue crosses US $400 Billion. Over its 60 years of existence, this mature industry has experimented with various models like integrated device manufacturer (IDM), fabless, and foundry concepts, each of

04Aug

A Review of the Chevy Bolt Powertrain

Posted: July 09, 2020 Contributed by: Sinjin Dixon-Warren, PhD Electric vehicles (EV) are potentially a disruptive technology in the automotive market. They offer the promise of increased energy efficiency and the potential for reduced emissions, depending on the primary energy source used to

09Jul

Memory Process Webinar: 3D NAND Word Line Pad (WLP)

Wednesday June 24, 2020 / 2:00 p.m. ET Hosted By: Chi Lim Tan 3D NAND, or vertical NAND, with its higher density and lower cost per bit, has been a driving force in the popularity of solid state drives (SSD) thanks to the innovation and continued investment from both manufacturers and suppliers. 9x

24Jun

Intel’s 10nm Node: Past, Present, and Future – Part 2

Some say that in the H2 2017 – H1 2018 timeframe Intel’s 10nm node were so half baked, that Intel had to significantly redesign its 10 nm process technology for subsequent products. In any case, one SKU and limited availability speak for themselves.

17Jun

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