Huawei Leads Imaging Chip Area Arms Race, Sony Wins Big with i-ToF, Emergence of Event-Driven Vision Sensors Posted: December 18, 2019 Contributing Authors: Ray Fontaine, Senior Technology Analyst Samsung, Huawei and Apple continue to push more imaging-related silicon into their flagship smartphone
Seoul Semiconductor recently dipped its toes into the sales side of the patent market with an announcement that it will be auctioning off two patent packages – one at the end of this month and the other in January.
Posted: December 12, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Consumer demand for smaller form factor and higher power, plus government efficiency regulations, are driving innovation in the USB adapter market. The USB-C power delivery standards are a further driver for innovation in this
集微网消息（文/Yuna），据Impress Watch网站报道，东芝在12月8日 召开的IEDM会议上声明在3D NAND闪存量产中采用类似于三星TCAT的存储单元结构。
As first published in the Patent Lawyer, Martin Bijman, Director of IP Products at TechInsights, explains how formalized assertion programs can benefit rights holders.
More nodes and alternative memories are in the works, but schedules remain murky.
TechInsights released a digest report titled “Intel Core i7-1065G7“ Ice Lake ”10 nm 2nd Gen Processor Analysis” on October 31st .
Recently, Huawei released its new 5G mobile phone, the Mate 30 5G series. The performance of its Kirin 990 5G SoC is very exciting. Recently, professional chip research institute TechInsights dismantled this commercial 5G integrated SoC chip.
Posted: November 8, 2019 Contributing Authors: Stacy Wegner Figure 1: the Apple U1 UWB chip One of the most intriguing components included in the iPhone 11 is the mystery chip Apple simply labeled as ‘U1.’ TechInsights has been busily analyzing this part, and we are excited about what we are finding
Introducing the Kirin 990 5G Posted: November 7, 2019 Contributing Authors: Daniel Yang, Stacy Wegner The Huawei Mate 30 Series is the latest installment of the company’s annual flagship smartphones, released on September 19, 2019 in Munich. TechInsights’ Deep Dive Teardown analysis is in progress
Date: November 6, 2019 / 3:00pm to 4:00pm ET Presented By: Neil MacLeod and Marty Bijman Internal Probing, Waveform Analysis, and More The widespread adoption and expansion of data centers has driven the SSD market to a period of high competition and high innovation, particularly in the areas of