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Posted: May 16, 2017 3D XPoint technology was unveiled by Intel and Micron in August 2015, creating the first new memory category in more than 25 years. When Intel announced the Optane brand for storage products based on 3D XPoint technology, it would first come to market in a new line of high

Posted: May 11, 2017 Sony Mobile announced the Xperia XZs at Mobile World Congress in February 2017. The Xperia XZs features a 1/2.3-inch optical format, 19 Mp resolution, Exmor RS “Motion Eye” camera offering with 960 fps video and predictive capture. The super slow motion functionality is made

May 8th, 2019 TechInsights will be a gold sponsor at the upcoming IAM IP in the Auto Industry event in Detroit. Jim Hines, Director, Automotive Products, will be a speaker on the “The future car part two: the connected car” panel.

Posted: April 26, 2017 The Qualcomm Snapdragon 835 applications processor found in the Samsung Galaxy S8 is confirmed to be built on Samsung’s 10 nm LPE process. Debut devices for the 10 nm LPE are the Qualcomm Snapdragon 835 and the Samsung Exynos 9 application processors. We have started our

Posted: April 20, 2017 Qualcomm WTR5975 Gigabit LTE Transceiver The WTR5975 is a member of the Snapdragon 835 family found in the Samsung Galaxy S8 and is the world’s first single-chip RF IC supporting Gigabit Class LTE, LTE-U, and LAA with 5 GHz unlicensed band support. The highly integrated

Posted: February 10, 2017 Contributing Authors: Ray Angers, Goran Grbic and Martin Bijman Microsoft recently launched a new service to their cloud customers offering protection against patent infringement lawsuits. TechInsights was given early access to the patents being made available to Microsoft

Posted: January 20, 2017 Apple W1 343S00131 Bluetooth Module The W1 chip found in the Beats Studio wireless headphone has the package mark 343S00131. Meanwhile, the W1 chip torn down from the Apple AirPods has the package mark 343S00130. They have a slight difference in the last digit in the package