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Posted: January 17, 2018 Toshiba 64L NAND – BiCS FLASH Toshiba released their 64L NAND solution (BiCS FLASH) in a SanDisk Ultra 3d SSD in 2017. TechInsights has conducted a significant amount of analysis on this product, including the following highlights: Memory density reached up to 3.40 Gb/mm 2 ,

Posted: January 17, 2018 Samsung 64L 3D V-NAND Samsung released their 64L 3D V-NAND solution in January of 2017 for key IT customers, and ramped up production in June for its expanded general market. The innovation included the following highlights: Vertical NAND cell structure with 71 gates and 20

There are many tools designed to help IP owners in the value creation process, but selecting the right ones can be a tough task. Considering the key issues can help to simplify the process...

Posted: December 15, 2017 In April 2017, Samsung became the world’s first manufacturer to mass produce 10 nm-class DRAM. In June 2017, TechInsights published a blog based on our first learnings on this innovation that detailed a memory density increase of 32.8% when comparing 8Gb DRAM 18 nm and 20

December 12, 2017 Contributing Authors: Stacy Wegner, Daniel Yang Gear Fit 2 Pro SM-R365 As the gift-giving season approaches and people start dreading thinking of their New Year’s resolutions, the fitness wearable market becomes more active (pun intended, more to come). We have seen our share of

Posted: November 17, 2017 Significant intellectual property has been developed around these algorithms related to error correction, read-retry techniques, wear leveling, garbage collection, data flush, and data trimming, amongst others. Testing the interface between the controller and the flash

Posted: November 10, 2017, Updated: November 15, 2017 Contributing Authors: Al Cowsky, Stacy Wegner While Apple and Samsung have been engaged in a tug-of-war for the title of top-selling smartphone provider over the past couple of years, China’s dominant OEM – Huawei – has been quietly gaining

Posted: November 9, 2017 Intel/Micron 64L 3D NAND Analysis The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L. The device boasts a more compacted die floorplan, improved memory peripheral design, and a 90%

Posted: September 13, 2017, Updated: November 8, 2017 Contributing Authors: Daniel Yang, Stacy Wegner, Jim Morrison Apple iPhone X Apple used the tagline “Say hello to the future” to introduce the era of the iPhone X, and with the iPhone X in our lab for teardown, we are working to bring our readers

Posted: November 1, 2017, Updated: November 6, 2017 Contributing Authors: Al Cowsky While Apple and Samsung have been engaged in a tug-of-war for the title of top-selling smartphone provider over the past couple of years, China’s dominant OEM - Huawei - has been quietly gaining traction globally

Posted: October 26, 2017, Updated: November 15, 2017 Contributing Authors: Daniel Yang, Stacy Wegner Typically we save these kinds of full-court-press teardown events for an Apple or a Samsung Galaxy, and no doubt we are gearing up for iPhone X quick-turn teardown this week , but today we are