Newsroom | TechInsights

Samsung Galaxy Note9 Teardown

Posted: August 14, 2018 Contributing Author: Daniel Yang Inside the Samsung Galaxy Note9 Teardown Samsung officially released its latest Galaxy Note9 on August 9th. Our procurement team did an amazing job in getting the phone into our labs the very next day! The model of our Note9 is AT&T SM-N960U,

14Aug

$8.5B For Auto, IoT, Security Startups

First-half funding analysis shows continued robust investment in tech.

08Aug

Patent Portfolio Management: Finding the Right Balance of Quantity vs. Quality

Portfolio managers have different strategies for managing their patent portfolios. At a high level, most strategies pivot on a balance of quantity versus quality to achieve the desired business outcomes. These outcomes include: improving your brand; freedom to operate; providing a healthy return on

06Aug

Automotive Patents: Owners, Technologies, and Investigating for EOU

Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future of mobility is evolving, and the automobile is

11Jul

Creating Better Applications Through Patent Strengthening

Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.

20Jun

First Look at Intel’s 10nm Cannon Lake CPU Die

TechInsights analysts have picked up Lenovo’s first 10nm CPU and taken it apart to take a look at the processor. This is the first time we’ve seem a Cannon Lake CPU in the wild, this is Intel’s much-maligned 10nm process and based on a 71mm Cannon Lake die.

14Jun

Intel 10 nm Logic Process Analysis (Cannon Lake)

Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor density of 100.8 mega transistors per mm 2 ,

12Jun

SK hynix 72L 3D NAND Analysis

Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time (tPROG), the memory bit density, with 3.55 Gb/mm 2

31May

Philip Morris device knows a lot about your smoking habit

Unlike a conventional cigarette, the iQOS is an electronic device with circuitry that enables it to collect user information. A teardown analysis shows this could give the tobacco giant remarkable insight into people's smoking habits. Philip Morris says it only uses the data to fix malfunctions.

15May

Micron 1x nm DDR Analysis

Posted: May 14, 2018 TechInsights has found the Micron 1x nm process in the Micron DIMM (DDR4) and Huawei Mate 10 (LPDDR4). This process brings about smaller die sizes and increased bit density over its predecessor, but it also presented a bit of a surprise… The Micron 1xs nm. When we analyzed a

14May

TIPS - Investigating Patented Technology in Challenging Product Areas

Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas

Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These can be devices that are physically impossible to re

03May

Samsung’s Anti-Fuse Technology found on 18 nm DRAM

Posted: April 11, 2018 Contributing Author: Jeongdong Choe, Senior Technical Fellow We at TechInsights are happy to report that we have found and analyzed Anti-fuse array blocks on a Samsung 18 nm DDR4 DRAM die. Anti-fuse is one of the embedded NVM technologies, which include: embedded Flash ROM

11Apr

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