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Posted: June 05, 2017 Contributing Authors: Jeongdong Choe, Senior Technical Fellow Die Photo SK hynix successively developed their 2nd generation 21 nm DRAM technology last year. Low yield and reliability issues on 21 nm 1st generation, means their new 2nd generation 21 nm DRAM cell technology has

Posted: May 18, 2017 Contributing Authors: Jeongdong Choe, Senior Technical Fellow Figure 1: Xpoint Memory Package Figure 2: Xpoint Memory Die (16 GB) TechInsights recently acquired and tore down an Intel OptaneTM M.2 80mm 16GB PCIe 3.0 and discovered a 3D X-Point memory die in the package. This is

Posted: May 16, 2017 3D XPoint technology was unveiled by Intel and Micron in August 2015, creating the first new memory category in more than 25 years. When Intel announced the Optane brand for storage products based on 3D XPoint technology, it would first come to market in a new line of high

Posted: May 11, 2017 Sony Mobile announced the Xperia XZs at Mobile World Congress in February 2017. The Xperia XZs features a 1/2.3-inch optical format, 19 Mp resolution, Exmor RS “Motion Eye” camera offering with 960 fps video and predictive capture. The super slow motion functionality is made

Posted: May 2, 2017 Contributing Authors: Dick James, Fellow Emeritus During the ISSCC conference last February, Sony issued a press release describing “Industry's First 3-Layer Stacked CMOS Image Sensor with DRAM for Smartphones” . There have been rumours of image sensors with embedded DRAM (to

Posted: April 26, 2017 The Qualcomm Snapdragon 835 applications processor found in the Samsung Galaxy S8 is confirmed to be built on Samsung’s 10 nm LPE process. Debut devices for the 10 nm LPE are the Qualcomm Snapdragon 835 and the Samsung Exynos 9 application processors. We have started our

Posted: April 24, 2017 Contributing Authors: Andy Wei With the first set of Samsung Galaxy S8 teardowns , we have access now to the first SoCs produced on “10 nm” class technology. First to the 10 nm productization finish line is the Qualcomm Snapdragon 835, built on Samsung LSI Foundry’s 10 nm LPE

Posted: April 20, 2017 Qualcomm WTR5975 Gigabit LTE Transceiver The WTR5975 is a member of the Snapdragon 835 family found in the Samsung Galaxy S8 and is the world’s first single-chip RF IC supporting Gigabit Class LTE, LTE-U, and LAA with 5 GHz unlicensed band support. The highly integrated

Posted: April 7, 2017, Updated: April 25, 2017 We are excited to announce receipt of our Galaxy S8. Our blog details teardown findings including cost observations, verification of the 10 nm LPE process, commentary on the Qualcomm WTR5975 Gigabit LTE Transceiver and envelope tracking power supplies,

Posted: March 3, 2017, Updated: April 24, 2017 Nintendo Switch Packaging Friday was a big day for Nintendo, and indeed the gaming community as a whole, with the launch of the new and innovative console-tablet hybrid, the Nintendo Switch. For consumers lucky enough to get their hands on this new

Posted: February 10, 2017 Contributing Authors: Ray Angers, Goran Grbic and Martin Bijman Microsoft recently launched a new service to their cloud customers offering protection against patent infringement lawsuits. TechInsights was given early access to the patents being made available to Microsoft

Posted: January 20, 2017 Apple W1 343S00131 Bluetooth Module The W1 chip found in the Beats Studio wireless headphone has the package mark 343S00131. Meanwhile, the W1 chip torn down from the Apple AirPods has the package mark 343S00130. They have a slight difference in the last digit in the package