Strategic Cost and Price Model 2 Min Read December 8, 2025 Detailed cost and price model for 300mm wafer fabs, projecting Logic, DRAM, 3DNAND to 2030; latest update covers YMTC 3DNAND. The Strategic Cost and Price Model is the world’s most detailed cost and price model of 300mm wafer fabs. The model

The Memory Embedded and Emerging Briefing presentation discusses trends leading to optimistic market forecasts, emerging storage NVM devices (including MRAM, PCRAM, ReRAM, FeRAM, eFLASH) and anticipated market trends focused on deeper integration and scaling technologies.

Weekly semiconductor sales show decreases on weekly basis but growth annually as of November 28, 2025, with a focus on various IC segments including NAND and DRAM.

Analysis of wafer production costs using Semiconductor Manufacturing Economics (SME) for IDMs and foundries relevant to the automotive semiconductor supply chain.

The report details a Memory Floorplan Analysis of the Samsung Exynos Connect U100 ultra-wideband chip, highlighting its capabilities for precise indoor tracking.

Global smartwatch shipments grew by 5.7% in Q4 2024 and 3.8% in Q3 2025, driven by strong sales from Apple, Samsung, and others, despite economic challenges.

This Excel Tracker displays Q3 2025 Notebook PC market share data by vendor, OS, and region, offering live updates and customizable download options.

Samsung has unveiled the Galaxy Z TriFold with a 10-inch display and Snapdragon 8 Elite. Limited initial shipments will rollout globally after 2026.

The future of automobiles will focus on connected, autonomous, software-defined, and electrified vehicles, shaped by tech advancements and regulations.

This report analyzes the floorplan of the ISP die from Sony IMX914 CMOS sensor, used in the front camera of Apple's iPhone 17 Air and Pro Max.

Global smartphone shipments rose 3% YoY and sales increased 8% YoY in October 2025, with Apple leading ahead of Samsung and Xiaomi.

The APC report details NVIDIA's GB10 Superchip, featuring a chiplet design with advanced inter-die communication via NVLink-C2C and TSMC's CoWoS-R packaging.