Discover how AI, Logic, and 3D NAND are driving a surge in semiconductor carbon emissions—key insights from the Global Semiconductor Carbon Emissions Forecast, 2026–2030.
TechInsights’ teardown of the Huawei Mate 80 Pro Max confirms the Kirin 9030 Pro on SMIC’s N+3 process and reveals major upgrades in display, cameras, and connectivity.
Discover the five expectations defining advanced packaging in 2026, including CPO adoption, HBM4 demand, panel and glass scaling, 3D thermal challenges, and chiplets for mobile.
Trump’s approval of H200 exports to China could reshape GPU, packaging, and HBM markets. TechInsights analyzes supply constraints, pricing, and $40–50B demand.
A high-level teardown overview of the Amazon Echo Show 21, highlighting design trends, cost contributors, and connectivity upgrades. Full deep dive available free on the TechInsights Platform.
Our Kirin 9030 analysis confirms SMIC’s N+3 node and reveals how it compares to industry 5nm. Get process measurements, density benchmarks, and expert analysis.
AI GPU production will account for 8.7% of all semiconductor sector emissions by 2030. The Global AI GPU Manufacture Carbon Emissions Forecast, 2026-2030, contains the critical data and strategic insights needed to navigate this accelerating environmental transition.
TechInsights confirms China’s first commercial STT-MRAM shipments, signaling a major semiconductor milestone and new competition in emerging memory markets.
TechInsights’ Cost Explorer adds cost, cycle time, and carbon modeling to Synopsys DTCO workflows, enabling full PPACtE optimization before costly test wafers.
Sony debuts its first 200MP smartphone sensor, the LYTIA 901, featuring a 1/1.12-inch format, 0.7µm pixels, AI remosaicing, advanced HDR, and flagship zoom performance.
TechInsights’ teardown of the Apple iPhone Air A3260 reveals 29 new components, a BOM cost 2% higher than Samsung’s S25 Edge, and key cost drivers in silicon and RF.
