NVIDIA Vera Rubin tackles the AI inference memory bottleneck with BlueField-4, rack-scale CPU-GPU design, and optimized KV cache for large-context LLMs.
Learn how teardown analysis reveals competitor cost-to-feature strategies and gives manufacturers the evidence they need to optimize costs with confidence.
Explore Intel Panther Lake on Intel 18A, examining advanced-node execution, IDM 2.0 credibility, and strategic implications for the global semiconductor ecosystem.
Discover how SEMI ISS set the tone for a hot 2026 as industry leaders weighed the AI‑driven surge, debated trillion‑dollar forecasts, and reflected on decades of chip‑cycle booms and busts.
Go beyond device specs with teardown-driven competitive benchmarking. Uncover die-level analysis, BOM insights, and supplier strategies. Download the white paper.
As we enter 2026, the semiconductor industry is no longer just chasing performance; it is chasing a sustainable path forward. The AI explosion has shifted the stakes from theoretical roadmaps to immediate resource constraints.
HBM is becoming the backbone of AI, but its carbon and supply chain footprint is growing rapidly. Explore how surging demand for stacked memory is reshaping DRAM investment, straining wafer capacity, and multiplying emissions through complex packaging, yield loss, and duplicated fabs on carbon-intensive grids.
The semiconductor industry is about to achieve something that seemed years away: breaking through the $1 trillion revenue threshold in 2026, roughly four years earlier than most forecasts predicted. What changed? In a word: AI.
