Memory Technology Roadmap
DRAM, NAND, HBM & Emerging Memory
What's Next for AI and Semiconductor Innovation?
Join Dr. Jeongdong Choe, Senior Technical Fellow at TechInsights, for an in-depth look at the latest DRAM, NAND Flash, HBM, and emerging memory technologies. Built on TechInsights' reverse engineering and semiconductor analysis, this webinar explores how leading memory manufacturers are advancing technology and what those innovations mean for the future of AI, data centers, automotive, and consumer electronics.
Memory Technology Is Entering a New Era
AI is accelerating demand for faster, denser, and more efficient memory. As manufacturers push beyond traditional scaling limits, innovations in DRAM, NAND Flash, High Bandwidth Memory (HBM), and emerging memory technologies are redefining semiconductor design and manufacturing.
In this opening session of the Memory Intelligence Webinar Series, Dr. Jeongdong Choe examines the latest technology roadmaps from Samsung, SK hynix, Micron, KIOXIA, Western Digital, YMTC, and other industry leaders. Drawing on TechInsights' die-level reverse engineering and competitive analysis, you'll gain a clear understanding of not only what is changing, but how these devices are built and where memory technology is headed next.
DRAM Technology Roadmap
Discover how leading manufacturers continue to scale DRAM despite increasing physical and manufacturing challenges.
- Progress beyond sub-1a and 1b process generations
- High-k dielectrics, pillar capacitors, recessed-channel transistors, and HKMG peripheral transistors
- The impact of these advances on HBM and next-generation graphics
NAND Flash Innovation
Explore how memory suppliers continue increasing storage density while controlling manufacturing costs.
- The latest vertical layer-count advancements
- Wafer bonding and string-stacking technologies
- Channel etch innovations and future NAND architectures
Embedded & Emerging Memory
Understand where next-generation memory technologies are moving from research into commercial products.
- MRAM, STT-MRAM, PCRAM, ReRAM, and FeRAM
- Embedded memory trends across mobile, automotive, IoT, and edge AI
- Which technologies are positioned for broader adoption
Invaluable Insight from Industry-Recognized SMEs
Learn from leaders who bring decades of semiconductor expertise, real-world experience, and a track record of impactful research.
Dr. Jeongdong Choe
Jeongdong Choe has a Ph.D. in electronic engineering and 30 years’ experience in semiconductor process integration for DRAM, (V) NAND, SRAM, and logic devices. A Ph.D. in Electronics (Semiconductor) from Sungkyunkwan University, he also holds master’s and bachelor’s Degrees in Materials Engineering (Metallurgical) from Yonsei University. His background includes positions as a Team Lead in R&D for SK-Hynix and Samsung, where he optimized process and device architectures with state-of-the-art technologies for mass production.
At TechInsights he has been focusing on technology analysis on semiconductor process, device, and architecture. He has authored numerous articles on memory technology including DRAM Technology Trends, 2D and 3D NAND Process/Device Integration Details, and Emerging Memory such as STT-MRAM, XPoint, ReRAM and FeRAM Design and Architecture. He quarterly produces and updates a widely distributed memory roadmap on DRAM, NAND, and Emerging Memory. Jeongdong has over 100 filed/issued patents in semiconductor process integration for DRAM, (V)NAND, SRAM, and logic devices.
Continue the Series
This webinar is the first of three sessions in the Memory Intelligence Webinar Series.
Memory Technology Roadmap
Dr. Jeongdong Choe explores the latest advances in DRAM scaling, the NAND layer-count race, HBM’s role in AI infrastructure, and the current state of emerging memory technologies including MRAM, PCRAM, ReRAM, and FeRAM.
Memory Market Update
Mike Howard and Walt Coon examine AI-driven demand, pricing trends, supply dynamics, and the competitive outlook for the global memory market.
Executive Fireside Chat
Dr. Jeongdong Choe, Mike Howard, Walt Coon, and Mike Walden discuss how technology, markets, and materials innovation are shaping the future of memory.
Reserve Your Seat
Join TechInsights for an exclusive technical briefing on the future of DRAM, NAND Flash, HBM, and emerging memory technologies.
Can't attend live? Register today and we'll send you the recording after the event.
